WO2026055705 - ELECTRONIC MODULES AND ASSOCIATED SYSTEMS
National phase entry is expected:
Publication Number
WO/2026/055705
Publication Date
12.03.2026
International Application No.
PCT/US2025/045634
International Filing Date
09.09.2025
Title **
[English]
ELECTRONIC MODULES AND ASSOCIATED SYSTEMS
[French]
MODULES ÉLECTRONIQUES ET SYSTÈMES ASSOCIÉS
Applicants **
SEESCAN, INC.
Inventors
OLSSON, Mark
PARSONS, David
SULLIVAN, David
LEVIN, Ryan
WARREN, Alexander
Priority Data
63/692,642
09.09.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 3594 | |
| EPO | Filing, Examination, Granting | 38386 | |
| Japan | Filing, Examination, Granting | 3510 | |
| South Korea | Filing, Examination, Granting | 4836 | |
| USA | Filing, Examination, Granting | 12540 |
Total:
62,866
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Abstract[English]
Electronic circuit modules including a housing, electronic circuit board disposed in the housing, and a high density electrical connector to couple an electrical cable between the electronic circuit board and another circuit board or electrical connection point are disclosed. Some embodiments may include a heat sink, spring plate, and antenna coupled via coaxial cable through the heat sink to the electronic circuit board.[French]
L'invention concerne des modules de circuit électronique comprenant un boîtier, une carte de circuit électronique disposée dans le boîtier et un connecteur électrique haute densité destiné à coupler un câble électrique entre la carte de circuit électronique et une autre carte de circuit imprimé ou un autre point de connexion électrique. Certains modes de réalisation peuvent comprendre un dissipateur thermique, une plaque de ressort et une antenne couplés par l'intermédiaire d'un câble coaxial à travers le dissipateur thermique à la carte de circuit électronique.