WO2025106288 - DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM
National phase entry is expected:
Publication Number
WO/2025/106288
Publication Date
22.05.2025
International Application No.
PCT/US2024/054388
International Filing Date
04.11.2024
Title **
[English]
DEPOSITION MONITOR FOR SEMICONDUCTOR MANUFACTURING SYSTEM
[French]
DISPOSITI DE SURVEILLANCE DE DÉPÔT POUR SYSTÈME DE FABRICATION DE SEMI-CONDUCTEURS
Applicants **
AXCELIS TECHNOLOGIES, INC.
Inventors
GEISSBUHLER, Phillip
BASSOM, Neil
HOGLUND, David
ROMANOV, Vladimir
Priority Data
63/599,689
16.11.2023
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2274 | |
| EPO | Filing, Examination, Granting | 11220 | |
| Japan | Filing, Examination, Granting | 2336 | |
| South Korea | Filing, Examination, Granting | 2320 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,890
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
An ion implantation system includes a sensor (300) for monitoring depositions (370) of particles or flakes of other materials. The sensor monitors film thickness on a clear panel (320) from behind the clear panel by emitting light (380) and detecting reflections (385) from the light. The system generates an alert for a buildup thickness. The composition of the film may also be detected by the sensor.[French]
Un système d'implantation ionique comprend un capteur (300) pour surveiller des dépôts (370) de particules ou de copaux d'autres matériaux. Le capteur surveille l'épaisseur de film sur un panneau transparent (320) depuis l'arrière du panneau transparent en émettant de la lumière (380) et en détectant des réflexions (385) de la lumière. Le système génère une alerte relative à une épaisseur accumulée. La composition du film peut également être détectée par le capteur.