WO2026022835 - AN INTEGRATED CONTROLLER ASSEMBLY FOR A VEHICLE
National phase entry is expected:
Publication Number
WO/2026/022835
Publication Date
29.01.2026
International Application No.
PCT/IN2024/052121
International Filing Date
24.10.2024
Title **
[English]
AN INTEGRATED CONTROLLER ASSEMBLY FOR A VEHICLE
[French]
ENSEMBLE DISPOSITIF DE COMMANDE INTÉGRÉ POUR VÉHICULE
Applicants **
TVS MOTOR COMPANY LIMITED
Inventors
SINGH, Ritik
BANSAL, Himanshu
MAZUMDAR, Dipanjan
SAGARE, Datta Rajaram
Priority Data
202441056679
25.07.2024
IN
Application details
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International Searching Authority |
IP India
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2237 | |
| EPO | Filing, Examination, Granting | 12056 | |
| Japan | Filing, Examination, Granting | 2155 | |
| South Korea | Filing, Examination, Granting | 2137 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
23,325
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Abstract[English]
The present disclosure relates to an integrated controller assembly (100) for a vehicle. The integrated controller assembly (100) includes a casing (102), a circuit board (104) disposed in the casing (102), and one or more thermal pads (108). The circuit board has a base substrate (110) having a first predefined region (110A) and a second predefined region (110B). The first predefined region (110A) is adapted to accommodate a first set of electronic components (112), and the second predefined region (110B) is adapted to accommodate a second set of electronic components (114). The one or more thermal pads (118) are disposed below the base substrate (110). The one or more thermal pads (118) are in thermal communication with at least the first predefined region (110A) and are configured to dissipate heat generated by the first set of electronic components (112).[French]
La présente divulgation concerne un ensemble dispositif de commande intégré (100) pour un véhicule. L'ensemble dispositif de commande intégré (100) comprend un boîtier (102), une carte de circuit imprimé (104) disposée dans le boîtier (102), et un ou plusieurs plots thermiques (108). La carte de circuit imprimé a un substrat de base (110) ayant une première région prédéfinie (110A) et une seconde région prédéfinie (110B). La première région prédéfinie (110A) est conçue pour recevoir un premier ensemble de composants électroniques (112), et la seconde région prédéfinie (110B) est conçue pour recevoir un second ensemble de composants électroniques (114). Le ou les plots thermiques (118) sont disposés au-dessous du substrat de base (110). Le ou les plots thermiques (118) sont en communication thermique avec au moins la première région prédéfinie (110A) et sont configurés pour dissiper la chaleur générée par le premier ensemble de composants électroniques (112).