WO2025238548 - MODULAR AXIALLY STACKED PRINTED CIRCUIT BOARD AND HEAT SINK ASSEMBLY AND WELL INTERVENTION TOOL COMPONENT USING THE ASSEMBLY
National phase entry is expected:
Publication Number
WO/2025/238548
Publication Date
20.11.2025
International Application No.
PCT/IB2025/055009
International Filing Date
13.05.2025
Title **
[English]
MODULAR AXIALLY STACKED PRINTED CIRCUIT BOARD AND HEAT SINK ASSEMBLY AND WELL INTERVENTION TOOL COMPONENT USING THE ASSEMBLY
[French]
CARTE DE CIRCUIT IMPRIMÉ EMPILÉE AXIALEMENT MODULAIRE ET ENSEMBLE DISSIPATEUR THERMIQUE ET COMPOSANT D'OUTIL D'INTERVENTION DE PUITS UTILISANT L'ENSEMBLE
Applicants **
HEPHAE ENERGY TECHNOLOGY EUROPA S.L
Inventors
PLATA, Gorka
HARVEY, Peter
WHITE, Matthew
Priority Data
63/647,237
14.05.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2314 | |
| EPO | Filing, Examination, Granting | 13236 | |
| Japan | Filing, Examination, Granting | 2464 | |
| South Korea | Filing, Examination, Granting | 2700 | |
| USA | Filing, Examination, Granting | 13540 |
Total:
34,254
Contact Us
Abstract[English]
A printed circuit board (PCB) assembly has a PCB. A circumference of the PCB comprises a plurality of circumferentially spaced apart first protrusions. Adjacent pairs of the first protrusions each define a notch therebetween. An upper heat sink comprises a ring and a plurality of circumferentially spaced apart second protrusions on a perimeter of the ring. The second protrusions are longer than an axial dimension of the ring wherein the second protrusions extend through respective notches on the PCB. A circular base plate has third protrusions on a circumference thereof, wherein each of the third protrusions corresponds to one of the second protrusions when the base plate and the PCB are assembled to one axial side of the upper heat sink.[French]
L'invention concerne un ensemble carte de circuit imprimé (PCB) comprenant une PCB. Une circonférence de la PCB comprend une pluralité de premières saillies espacées de manière circonférentielle. Des paires adjacentes des premières saillies définissent chacune une encoche entre elles. Un dissipateur thermique supérieur comprend un anneau et une pluralité de deuxièmes saillies espacées de manière circonférentielle sur un périmètre de l'anneau. Les deuxièmes saillies sont plus longues qu'une dimension axiale de l'anneau, les deuxièmes saillies s'étendant à travers des encoches respectives sur la PCB. Une plaque de base circulaire comprend des troisièmes saillies sur une circonférence de celle-ci, chacune des troisièmes saillies correspondant à l'une des deuxièmes saillies lorsque la plaque de base et la PCB sont assemblées sur un côté axial du dissipateur thermique supérieur.