WO2025224640 - HEAT SPREADING DEVICES AND TEMPERATURE-CONTROLLED SYSTEM
National phase entry is expected:
Publication Number
WO/2025/224640
Publication Date
30.10.2025
International Application No.
PCT/IB2025/054223
International Filing Date
23.04.2025
Title **
[English]
HEAT SPREADING DEVICES AND TEMPERATURE-CONTROLLED SYSTEM
[French]
DISPOSITIFS DE DISSIPATION DE CHALEUR ET SYSTÈME À TEMPÉRATURE RÉGULÉE
Applicants **
MEHTA, Mitul
Inventors
MEHTA, Mitul
Priority Data
24172336.0
25.04.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Natural Person
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2280 | |
| EPO | Filing, Examination, Granting | 8806 | |
| Japan | Filing, Examination, Granting | 2368 | |
| South Korea | Filing, Examination, Granting | 2511 | |
| USA | Filing, Examination, Granting | 5140 |
Total:
21,105
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Abstract[English]
A heat spreading device (100) is disclosed. The heat spreading device (100) includes a diamond substrate (108) comprising one or more irregular and/or nonlinear microchannels (112) provided on a first side (114) of the diamond substrate (108). The heat spreading device (100) further includes one or more thermal vias (116) provided on a second side (118) of the diamond substrate (108) opposite to the one or more irregular- and/or nonlinear- microchannels (112). The one or more thermal vias (116) are configured to be connected to one or more heat generating sources (104) for transferring a heat generated from the one or more heat generating sources (104) to the diamond substrate (108).[French]
Un dispositif de dissipation de chaleur (100) est divulgué. Le dispositif de dissipation de chaleur (100) comprend un substrat de diamant (108) qui comporte un ou plusieurs microcanaux irréguliers et/ou non linéaires (112) situés sur un premier côté (114) du substrat de diamant (108). Le dispositif de dissipation de chaleur (100) comprend en outre un ou plusieurs trous d'interconnexion thermiques (116) situés sur un second côté (118) du substrat de diamant (108) opposé audit un ou plusieurs microcanaux irréguliers et/ou non linéaires (112). Le ou les trous d'interconnexion thermiques (116) sont conçus pour être connectés à une ou à plusieurs sources de génération de chaleur (104) afin de transférer la chaleur générée par la ou les sources de génération de chaleur (104) au substrat de diamant (108).