WO2025149924 - DATA COMMUNICATION DEVICE
National phase entry is expected:
Publication Number
WO/2025/149924
Publication Date
17.07.2025
International Application No.
PCT/IB2025/050221
International Filing Date
09.01.2025
Title **
[English]
DATA COMMUNICATION DEVICE
[French]
DISPOSITIF DE COMMUNICATION DE DONNÉES
Applicants **
MARVELL ASIA PTE LTD
Inventors
TUMNE, Pushkraj
COCCIOLI, Roberto
SHIRLEY, Dwayne R.
WANG, Hsiu-Che
Priority Data
63/620,082
11.01.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2248 | |
| EPO | Filing, Examination, Granting | 11702 | |
| Japan | Filing, Examination, Granting | 2399 | |
| South Korea | Filing, Examination, Granting | 2439 | |
| USA | Filing, Examination, Granting | 5140 |
Total:
23,928
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Abstract[English]
A communication device (22), consisting of at least one semiconducting die (38) and an electronic integrated circuit (EIC) (14A) formed on a first side (34) of the at least one die. The device also has at least one first array of micro-light emitting diodes (micro-LEDs) (50), mounted on a second side (54) of the at least one die that is opposite the first side. The micro-LEDs are electrically connected to the EIC and are configured to transmit outbound optical signals to respective first optical fibers. The device also has at least one second array of photo-diodes (60), mounted on the second side of the at least one die. The photo-diodes are electrically connected to the EIC and are configured to receive inbound optical signals from respective second optical fibers.[French]
L'invention concerne un dispositif de communication (22), constitué d'au moins une puce semi-conductrice (38) et d'un circuit intégré électronique (EIC) (14A) formé sur un premier côté (34) de la ou des puces. Le dispositif comprend également au moins un premier réseau de micro-diodes électroluminescentes (micro-DEL) (50), monté sur un second côté (54) de la ou des puces qui est opposé au premier côté. Les micro-DEL sont électriquement connectées à l'EIC et sont configurées pour transmettre des signaux optiques sortants à des premières fibres optiques respectives. Le dispositif comprend également au moins un second réseau de photo-diodes (60), monté sur le second côté de la ou des puces. Les photo-diodes sont électriquement connectées à l'EIC et sont configurées pour recevoir des signaux optiques entrants provenant de secondes fibres optiques respectives.