WO2025083447 - THERMAL MANAGEMENT STRUCTURE FOR POWER ELECTRONIC DEVICE
National phase entry is expected:
Publication Number
WO/2025/083447
Publication Date
24.04.2025
International Application No.
PCT/IB2023/060424
International Filing Date
16.10.2023
Title **
[English]
THERMAL MANAGEMENT STRUCTURE FOR POWER ELECTRONIC DEVICE
[French]
STRUCTURE DE GESTION THERMIQUE POUR DISPOSITIF ÉLECTRONIQUE DE PUISSANCE
Applicants **
TI AUTOMOTIVE TECHNOLOGY CENTER GMBH
Inventors
HOLTZ, Jonathan
BEKKER, Justin
SCHAEFER, Thorsten
DEIBEL, Florian
SUTHERLAND, Andy
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2214 | |
| EPO | Filing, Examination, Granting | 12696 | |
| Japan | Filing, Examination, Granting | 2431 | |
| South Korea | Filing, Examination, Granting | 2537 | |
| USA | Filing, Examination, Granting | 5540 |
Total:
25,418
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A thermal management structure for a power electronic device includes a base body receiving the power electronic device. The base body is formed with a double wall having an inner layer and an outer layer. The inner layer forms a plurality of channels for transporting a temperature control media, and is securely attached to the outer layer. The plurality of channels formed by the inner layer and the outer layer are connected to each other such that the temperature control media entering into a first end of the plurality of channels flows through the channels and exits through a second end of the plurality of channels. Accordingly, the thermal management structure is configured to control the temperature of the power electronic device placed in the base body.[French]
L'invention concerne une structure de gestion thermique pour un dispositif électronique de puissance comprenant un corps de base recevant le dispositif électronique de puissance. Le corps de base est formé avec une double paroi ayant une couche intérieure et une couche extérieure. La couche intérieure forme une pluralité de canaux pour transporter un milieu de régulation de température, et est solidement fixée à la couche extérieure. La pluralité de canaux formés par la couche intérieure et la couche extérieure sont reliés l'un à l'autre de telle sorte que le milieu de régulation de température entrant dans une première extrémité de la pluralité de canaux s'écoule à travers les canaux et sort par une seconde extrémité de la pluralité de canaux. En conséquence, la structure de gestion thermique est configurée pour commander la température du dispositif électronique de puissance placé dans le corps de base.