WO2024047565 - AEROGEL HEAT EXTRACTION APPARATUS FOR DATA CENTERS AND ENERGY STORAGE SYSTEMS
National phase entry is expected:
Publication Number
WO/2024/047565
Publication Date
07.03.2024
International Application No.
PCT/IB2023/058593
International Filing Date
30.08.2023
Title **
[English]
AEROGEL HEAT EXTRACTION APPARATUS FOR DATA CENTERS AND ENERGY STORAGE SYSTEMS
[French]
APPAREIL D'EXTRACTION DE CHALEUR D'AÉROGEL POUR CENTRES DE DONNÉES ET SYSTÈMES DE STOCKAGE D'ÉNERGIE
Applicants **
ROVA CORPORATION
Inventors
KIM, Jason
HAHN, Choonsoo
Priority Data
17/899,454
30.08.2022
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
MOIP
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2067 | |
| EPO | Filing, Examination, Granting | 11561 | |
| Japan | Filing, Examination, Granting | 2151 | |
| South Korea | Filing, Examination, Granting | 1605 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,124
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Contact Us
Abstract[English]
A device includes an enclosure for one or more electronic devices. The enclosure includes an insulation layer that includes aerogels and binder. The insulation layer may have a thermal conductivity of less than 30 mW / m·K at 25°C.[French]
Un dispositif comprend une enceinte pour un ou plusieurs dispositifs électroniques. L'enceinte comprend une couche d'isolation qui comprend des aérogels et un liant. La couche d'isolation peut avoir une conductivité thermique inférieure à 30 mW/m.K à 25° C