WO2023218356 - CARTRIDGE WITH INTERNAL PILLAR
National phase entry:
Publication Number
WO/2023/218356
Publication Date
16.11.2023
International Application No.
PCT/IB2023/054802
International Filing Date
09.05.2023
Title **
[English]
CARTRIDGE WITH INTERNAL PILLAR
[French]
CARTOUCHE AVEC PILIER INTERNE
Applicants **
VUEREAL INC.
Inventors
CHAJI, Gholamreza
FATHI, Ehsanollah
Priority Data
63/339,935
09.05.2022
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
CIPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 3086 | |
| EPO | Filing, Examination, Granting | 28886 | |
| Japan | Filing, Examination, Granting | 3203 | |
| South Korea | Filing, Examination, Granting | 4384 | |
| USA | Filing, Examination, Granting | 10540 |
Total:
50,099
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The present invention discloses a process to transfer microdevices. The method involves coupling a microdevice to a donor substrate by a pillar layer, aligning the microdevice, bonding the microdevice and breaking the pillar layer with various scenarios. Also disclosed are various configurations of pillars within the structure such as edges and floating layers. Further, the method also discloses use and formation of nano-pillars to achieve the transfer of microdevices.[French]
La présente invention concerne un procédé de transfert de micro-dispositifs. Le procédé comprend le couplage d'un microdispositif à un substrat donneur par une couche de pilier, l'alignement du microdispositif, la liaison du microdispositif et la rupture de la couche de pilier avec divers scénarios. L'invention concerne également diverses configurations de piliers à l'intérieur de la structure tels que des bords et des couches flottantes. En outre, le procédé décrit également l'utilisation et la formation de nano-piliers pour permettre le transfert de micro-dispositifs.