WO2023118939 - BACKSIDE OPTICAL CONNECTOR FOR COUPLING SINGLE-MODE FIBER TO A SILICON PHOTONICS CHIP
National phase entry is expected:
Publication Number
WO/2023/118939
Publication Date
29.06.2023
International Application No.
PCT/IB2021/062224
International Filing Date
22.12.2021
Title **
[English]
BACKSIDE OPTICAL CONNECTOR FOR COUPLING SINGLE-MODE FIBER TO A SILICON PHOTONICS CHIP
[French]
CONNECTEUR OPTIQUE CÔTÉ ARRIÈRE POUR COUPLER UNE FIBRE MONOMODALE À UNE PUCE PHOTONIQUE EN SILICIUM
Applicants **
TERAMOUNT LTD.
18 Hartom Street, Har Hotzvim
9777516 Jerusalem, IL
Inventors
TAHA, Hesham
c/o Teramount Ltd.
18 Hartom Street, Har Hotzvim
9777516 Jerusalem, IL
ISRAEL, Abraham
c/o Teramount Ltd.
18 Hartom Street, Har Hotzvim
9777516 Jerusalem, IL
HABER, Ilan
c/o Teramount Ltd.
18 Hartom Street, Har Hotzvim
9777516 Jerusalem, IL
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| * | |
International Searching Authority |
ILPO
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
* The data is based on automatic recognition. Please verify and amend if necessary.
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1427 | |
| EPO | Filing, Examination | 10419 | |
| Japan | Filing | 590 | |
| South Korea | Filing | 482 | |
| USA | Filing, Examination | 4110 |
Total: 17028 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.[French]
L'invention concerne un connecteur destiné à être utilisé pour coupler un signal optique entre une fibre optique dans un connecteur optique monté sur un fond d'une puce photonique en silicium (SiPh). Le connecteur comprend : un miroir incurvé ; et un miroir plat incliné ; au moins l'un du miroir incurvé et du miroir plat incliné étant formé sur un matériau d'impression estampé durci qui a été déposé sur la puce SiPh au moins dans une cavité de celle-ci.