WO2025256855 - BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM
National phase entry is expected:
Publication Number
WO/2025/256855
Publication Date
18.12.2025
International Application No.
PCT/EP2025/063334
International Filing Date
15.05.2025
Title **
[English]
BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM
[French]
STRUCTURE LIÉE COMPORTANT UN FILM ADHÉSIF THERMIQUEMENT DÉCOLLABLE
Applicants **
HENKEL AG & CO. KGAA
Inventors
MIGLIORE, Nicola
GUTSCHE, Nadine
GOETHEL, Frank
FRANKEN, Uwe
KOHLSTRUNG, Rainer
Priority Data
24181846.7
13.06.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2324 | |
| EPO | Filing, Examination, Granting | 10438 | |
| Japan | Filing, Examination, Granting | 2247 | |
| South Korea | Filing, Examination, Granting | 2259 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,008
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Abstract[English]
A bonded structure comprising: a first substrate (S1); a second substrate (S2); and, a thermally conductive adhesive layer which is interposed between said first and second substrates and which is disposed on said second substrate (S2); wherein, interposed between said first substrate (S1) and said thermally conductive adhesive layer, there is further provided: a dried ink layer, said dried ink layer comprising a matrix of polymeric resin (IR) and electrically conductive particles; and, a thermally debondable adhesive layer disposed on and in direct contact with said dried ink layer, said thermally debondable adhesive layer comprising a polymeric resin (AR) and thermally expandable thermoplastic microspheres.[French]
L'invention concerne une structure liée comprenant : un premier substrat (S1) ; un second substrat (S2) ; et une couche adhésive thermoconductrice qui est interposée entre lesdits premier et second substrats et qui est disposée sur ledit second substrat (S2), où, interposées entre ledit premier substrat (S1) et ladite couche adhésive thermoconductrice,se trouvent en outre : une couche d'encre séchée, ladite couche d'encre séchée comprenant une matrice de résine polymère (IR) et des particules électriquement conductrices ; et, une couche adhésive thermiquement décollable disposée sur et en contact direct avec ladite couche d'encre séchée, ladite couche adhésive thermiquement décollable comprenant une résine polymère (AR) et des microsphères thermoplastiques thermiquement expansibles.