WO2025228774 - VERBINDUNGSSYSTEM UND VERBINDUNGSANORDNUNG
National phase entry is expected:
Publication Number
WO/2025/228774
Publication Date
06.11.2025
International Application No.
PCT/EP2025/061177
International Filing Date
24.04.2025
Title **
[German]
VERBINDUNGSSYSTEM UND VERBINDUNGSANORDNUNG
[English]
CONNECTION SYSTEM AND CONNECTION ARRANGEMENT
[French]
SYSTÈME DE LIAISON ET AGENCEMENT DE LIAISON
Applicants **
ZF FRIEDRICHSHAFEN AG
Inventors
HEUDORFER, Michael
PAGEL, Janik
Priority Data
102024203967.5
29.04.2024
DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1909 | |
| EPO | Filing, Examination, Granting | 8113 | |
| Japan | Filing, Examination, Granting | 2029 | |
| South Korea | Filing, Examination, Granting | 1819 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,610
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Abstract[German]
Die vorliegende Erfindung bezieht sich auf ein Verbindungssystem mit einem ersten Element (20) und einem zweiten Element (22), wobei das erste Element (20) und das zweite Element (22) für ein Verbinden miteinander ineinander einführbar sind. Das erste Element (20) weist eine Schneidverzahnung (26) auf, welche bei dem Einführen ein korrespondierendes Zahnprofll (32) in das zweite Element (22) in einer Schnittrichtung (34) schneidet. Das zweite Element (22) weist eine Spanablösungsnut (60) auf, welche beim Erreichen einer Montageposition eine Spanabtrennung von dem zweiten Element (22) durch die Schneidverzahnung (26) verursacht. Zudem bezieht sich die Erfindung auf eine Verbindungsanordnung.[English]
The present invention relates to a connection system having a first element (20) and a second element (22), wherein the first element (20) and the second element (22) can be inserted into one another for connection to one another. The first element (20) has cutting teeth (26) which cut a corresponding tooth profile (32) into the second element (22) in a cutting direction (34) during insertion. The second element (22) has a chip removal groove (60) which results in a chip being removed from the second element (22) by means of the cutting teeth (26) when an assembly position is reached. The invention also relates to a connection arrangement.[French]
La présente invention concerne un système de liaison ayant un premier élément (20) et un second élément (22), le premier élément (20) et le second élément (22) pouvant être insérés l'un dans l'autre pour être reliés l'un à l'autre. Le premier élément (20) présente des dents de coupe (26) qui coupent un profil de dent correspondant (32) dans le second élément (22) dans une direction de coupe (34) pendant l'insertion. Le second élément (22) présente une rainure d'élimination de copeaux (60) qui permet d'éliminer des copeaux du second élément (22) au moyen des dents de coupe (26) lorsqu'une position d'assemblage est atteinte. L'invention concerne également un agencement de liaison.