WO2025242379 - BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM
National phase entry is expected:
Publication Number
WO/2025/242379
Publication Date
27.11.2025
International Application No.
PCT/EP2025/060909
International Filing Date
22.04.2025
Title **
[English]
BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM
[French]
STRUCTURE LIÉE COMPORTANT UN FILM ADHÉSIF POUVANT ÊTRE DÉCOLLÉ ÉLECTROCHIMIQUEMENT
Applicants **
HENKEL AG & CO. KGAA
Inventors
STRICKER, Lucas
HUEHNERGARTH, Philipp
STAPF, Stefanie
TAO, FangQi
TAPLAN, Christian
NEGELE, Carla
YANG, Jing
MO, Xun
Priority Data
PCT/CN2024/094168
20.05.2024
CN
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2680 | |
| EPO | Filing, Examination, Granting | 14230 | |
| Japan | Filing, Examination, Granting | 2431 | |
| South Korea | Filing, Examination, Granting | 2637 | |
| USA | Filing, Examination, Granting | 5540 |
Total:
27,518
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Abstract[English]
A bonded structure comprising: a first substrate provided with a first electrically conductive surface; a second substrate provided with a second electrically conductive surface; and, a cured, electrochemically debondable adhesive film interposed between said first and second electrically conductive surfaces, said electrochemically debondable adhesive film having one or more constituent layers, wherein at least one layer of the cured adhesive film comprises a non-polymerizable electrolyte and at least one polyurethane polymer; wherein at least one of said first and second electrically conductive surfaces is provided by a ink film which is obtained by the evaporative removal of solvent from an ink composition, said ink film comprising: a matrix of a polymeric resin (FR); and, electrically conductive particles.[French]
L'invention concerne une structure liée comprenant : un premier substrat présentant une première surface électriquement conductrice ; un second substrat présentant une seconde surface électroconductrice ; et un film adhésif pouvant être décollé électrochimiquement, durci et interposé entre lesdites première et seconde surfaces électroconductrices, ledit film adhésif pouvant être décollé électrochimiquement présentant une ou plusieurs couches constitutives, au moins une couche du film adhésif durci comportant un électrolyte non polymérisable et au moins un polymère de polyuréthane ; au moins l'une desdites première et seconde surfaces électriquement conductrices étant conférée par un film d'encre qui est obtenu par élimination par évaporation d'un solvant d'une composition d'encre, ledit film d'encre contenant : une matrice d'une résine polymère (FR) ; et des particules électriquement conductrices.