WO2025181387 - VERFAHREN UND VORRICHTUNG FÜR EIN CHIPLET-SYSTEM
National phase entry is expected:
Publication Number
WO/2025/181387
Publication Date
04.09.2025
International Application No.
PCT/EP2025/055659
International Filing Date
03.03.2025
Title **
[German]
VERFAHREN UND VORRICHTUNG FÜR EIN CHIPLET-SYSTEM
[English]
METHOD AND DEVICE FOR A CHIPLET SYSTEM
[French]
PROCÉDÉ ET DISPOSITIF POUR UN SYSTÈME DE MICROPUCES
Applicants **
ROBERT BOSCH GMBH
Inventors
BORRMANN, Jan Micha
Priority Data
102024201921.6
01.03.2024
DE
Application details
| Total Number of Claims/PCT | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2082 | |
| EPO | Filing, Examination, Granting | 9134 | |
| Japan | Filing, Examination, Granting | 2214 | |
| South Korea | Filing, Examination, Granting | 2197 | |
| USA | Filing, Examination, Granting | 8340 |
Total:
23,967
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Abstract[German]
Verfahren für ein Chiplet-System, das einen Träger, wenigstens eine erste auf dem Träger angeordnete Komponente und eine Kommunikationsschnittstelle zur Übertragung eines ersten Signals zwischen der ersten Komponente und, beispielsweise wenigstens, einer zweiten Komponente des Chiplet-Systems aufweist, wobei das Verfahren aufweist: Bereitstellen eines zweiten Signals mittels eines Bandspreizverfahrens, Übertragen des zweiten Signals über wenigstens eine Signalleitung der Kommunikationsschnittstelle.[English]
The invention relates to a method for a chiplet system comprising a substrate, at least one first component disposed on the substrate, and a communication interface for transmitting a first signal between the first component and, for example, at least one second component of the chiplet system, wherein the method comprises: providing a second signal by means of a spread spectrum technique, and transmitting the second signal via at least one signal line of the communication interface.[French]
L'invention concerne un procédé pour un système de micropuces comprenant un substrat, au moins un premier composant placé sur le substrat, et une interface de communication pour transmettre un premier signal entre le premier composant et, par exemple, au moins un second composant du système de micropuces, le procédé consistant à : fournir un second signal au moyen d'une technique d'étalement de spectre et transmettre le second signal par l'intermédiaire d'au moins une ligne de signal de l'interface de communication.