WO2025181229 - AIR BEARING FOR WAFER FOIL STRETCHING
National phase entry is expected:
Publication Number
WO/2025/181229
Publication Date
04.09.2025
International Application No.
PCT/EP2025/055331
International Filing Date
27.02.2025
Title **
[English]
AIR BEARING FOR WAFER FOIL STRETCHING
[French]
PALIER À AIR POUR UN ÉTIREMENT DE FEUILLE DE TRANCHE
Applicants **
NEXPERIA B.V.
Inventors
HUYBERS, Ralph
Priority Data
24159970.3
27.02.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Pages of Specification | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2026 | |
| EPO | Filing, Examination, Granting | 8107 | |
| Japan | Filing, Examination, Granting | 2154 | |
| South Korea | Filing, Examination, Granting | 2066 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
19,093
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Abstract[English]
Aspects of the present disclosure relate to a method for stretching a wafer foil that is held by a film frame carrier and on which a plurality of electronic components is arranged. Aspects of the present disclosure further relate to a method for transferring an electronic component. Further aspects of the present disclosure further relate to a device for stretching a wafer foil that is held by a film frame carrier and on which a plurality of electronic components is arranged, and to a pick-and-place apparatus for transferring an electronic component. For stretching the wafer foil, the film frame carrier is tensioned over a tensioning member by mutually moving the tensioning member and the film frame carrier. According to an aspect of the present disclosure, an air bearing is generated in between the wafer foil and the tensioning member at least during a part of the mutual movement of the film frame carrier and the tensioning member.[French]
Des aspects de la présente divulgation concernent un procédé permettant d'étirer une feuille de tranche qui est maintenue par un support de cadre de film et sur laquelle une pluralité de composants électroniques est agencée. D'autres aspects de la présente divulgation concernent en outre un procédé permettant de transférer un composant électronique. D'autres aspects de la présente divulgation concernent en outre un dispositif pour étirer une feuille de tranche qui est maintenue par un support de cadre de film et sur laquelle une pluralité de composants électroniques est agencée, et un appareil de saisie et de mise en place pour transférer un composant électronique. Pour étirer la feuille de tranche, le support de cadre de film est tendu sur un élément de tension en déplaçant mutuellement l'élément de tension et le support de cadre de film. Selon un aspect de la présente divulgation, un palier à air est généré entre la feuille de tranche et l'élément de tension au moins pendant une partie du mouvement mutuel du support de cadre de film et de l'élément de tension.