WO2025171983 - ANISOTROPICALLY CONDUCTIVE HEAT ACTIVATED ADHESIVE COMPOSITION
National phase entry is expected:
Publication Number
WO/2025/171983
Publication Date
21.08.2025
International Application No.
PCT/EP2025/051023
International Filing Date
16.01.2025
Title **
[English]
ANISOTROPICALLY CONDUCTIVE HEAT ACTIVATED ADHESIVE COMPOSITION
[French]
COMPOSITION ADHÉSIVE ACTIVÉE THERMIQUEMENT CONDUCTRICE DE MANIÈRE ANISOTROPE
Applicants **
HENKEL AG & CO. KGAA
Inventors
TAPLAN, Christian
GOETHEL, Frank
NEGELE, Carla
Priority Data
24158062.0
16.02.2024
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1969 | |
| EPO | Filing, Examination, Granting | 8107 | |
| Japan | Filing, Examination, Granting | 2092 | |
| South Korea | Filing, Examination, Granting | 1942 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,850
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Abstract[English]
The present invention relates to an anisotropically conductive heat activated adhesive composition, comprising a) one or more thermoplastic resin; b) metal coated particles; and c) a solvent selected from the group consisting of l-methoxy-2- propanylacetate,2-butoxyethyl acetate, 2-(2-butoxyethoxy)ethanol, [2-(2-butoxyethoxy)-ethyl]acetate, 2-butoxyethanol, isophorone, 3, 3, 5-trimethyl-2-cyclohexene-l-one, dimethyl succinate, dimethyl glutarate, dimethyl adipate, acetic acid, l-methoxypropan-2-ol, 1- methoxy-2-propylacetat, dipropylene glycol (mono)methylether, toluene, ethanol, isopropyl alcohol, n-propanol, ethoxy propanol, ethylacetate, butyl acetate, n-propyl acetate, isopropyl acetate, methyl ethyl ketone, methyl isobutyl ketone, glycol ethers and mixtures thereof, wherein the one or more thermoplastic resin is dissolved into the solvent. The composition can be used in electronic devices.[French]
La présente invention concerne une composition adhésive activée thermiquement conductrice de manière anisotrope, comprenant a) une ou plusieurs résines thermoplastiques ; b) des particules revêtues de métal ; et c) un solvant choisi dans le groupe constitué par le l-méthoxy-2-propanylacétate, le 2-butoxyéthyle acétate, le 2-(2-butoxyéthoxy)éthanol, le [2-(2-butoxyéthoxy)-éthyl]acétate, le 2-butoxyéthanol, l'isophorone, le 3, 3, 5-triméthyl-2-cyclohexène-l-one, le succinate de diméthyle, le glutarate de diméthyle, l'adipate de diméthyle, l'acide acétique, le l-méthoxypropan-2-ol, le 1-méthoxy-2-propylacétat, le dipropylène glycol (mono)méthyléther, le toluène, l'éthanol, l'alcool isopropylique, le n-propanol, l'éthoxy propanol, l'acétate d'éthyle, l'acétate de butyle, l'acétate de n-propyle, l'acétate d'isopropyle, la méthyléthylcétone, la méthylisobutylcétone, les éthers de glycol et leurs mélanges, la ou les résines thermoplastiques étant dissoutes dans le solvant. La composition peut être utilisée dans des dispositifs électroniques.