WO2024260662 - ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS
National phase entry is expected:
Publication Number
WO/2024/260662
Publication Date
26.12.2024
International Application No.
PCT/EP2024/063896
International Filing Date
21.05.2024
Title **
[English]
ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS
[French]
ENSEMBLE ÉLECTRONIQUE AYANT DES COMPOSANTS ÉLECTROCHIMIQUEMENT DÉTACHABLE
Applicants **
HENKEL AG & CO. KGAA
Henkelstrasse 67
40589 Düsseldorf, DE
Inventors
FRANKEN, Uwe
Haselnußweg 4
41542 Dormagen, DE
FLECK-KUNDE, Tom
Benrodestr. 84
40589 Düsseldorf, DE
BUGA, Duygu
Nordkanal Allee 40
41564 Kaarst, DE
STAPF, Stefanie
Zur Grafenburg 57 a
42549 Velbert, DE
KAMM, Thomas
Hitdorfer Straße 63
51371 Leverkusen, DE
Priority Data
23180283.6
20.06.2023
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| * | |
International Searching Authority |
EPO
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1712 | |
| EPO | Filing, Examination | 8823 | |
| Japan | Filing | 597 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 4310 |
Total: 16017 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
The present disclosure is directed to an electronics assembly comprising: a housing having walls which define an enclosure having at least one floored chamber, wherein at least one wall of the housing is provided with an electrically conductive surface which faces into a chamber; n electronic components disposed in the enclosure, wherein n is an integer of at least 2 and wherein at least a fraction of said electronic components are provided with an electrically conductive exterior surface; and, an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition comprising: a non-polymerizable electrolyte; a rheology control agent; and, a matrix resin.[French]
La présente invention concerne un ensemble électronique comprenant : un boîtier ayant des parois qui définissent une enceinte ayant au moins une chambre flottante, au moins une paroi du boîtier comportant une surface électriquement conductrice qui fait face à une chambre ; n composants électroniques disposés dans l'enceinte, n étant un nombre entier d'au moins 2 et au moins une fraction desdits composants électroniques comportant une surface extérieure électriquement conductrice ; et un adhésif par lequel ladite surface extérieure électriquement conductrice de ladite fraction de composants électroniques est collée à ladite surface électriquement conductrice de la paroi, l'ensemble électronique étant caractérisé en ce que ledit adhésif est obtenu par durcissement d'une composition adhésive électrochimiquement détachable durcissable comprenant : un électrolyte non polymérisable ; un agent de contrôle de rhéologie ; et une résine de matrice.