WO2024260662 - ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS
National phase entry is expected:
Publication Number
WO/2024/260662
Publication Date
26.12.2024
International Application No.
PCT/EP2024/063896
International Filing Date
21.05.2024
Title **
[English]
ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS
[French]
ENSEMBLE ÉLECTRONIQUE AYANT DES COMPOSANTS ÉLECTROCHIMIQUEMENT DÉTACHABLE
Applicants **
HENKEL AG & CO. KGAA
Inventors
FRANKEN, Uwe
FLECK-KUNDE, Tom
BUGA, Duygu
STAPF, Stefanie
KAMM, Thomas
Priority Data
23180283.6
20.06.2023
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2660 | |
| EPO | Filing, Examination, Granting | 15243 | |
| Japan | Filing, Examination, Granting | 2536 | |
| South Korea | Filing, Examination, Granting | 2894 | |
| USA | Filing, Examination, Granting | 6340 |
Total:
29,673
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The present disclosure is directed to an electronics assembly comprising: a housing having walls which define an enclosure having at least one floored chamber, wherein at least one wall of the housing is provided with an electrically conductive surface which faces into a chamber; n electronic components disposed in the enclosure, wherein n is an integer of at least 2 and wherein at least a fraction of said electronic components are provided with an electrically conductive exterior surface; and, an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition comprising: a non-polymerizable electrolyte; a rheology control agent; and, a matrix resin.[French]
La présente invention concerne un ensemble électronique comprenant : un boîtier ayant des parois qui définissent une enceinte ayant au moins une chambre flottante, au moins une paroi du boîtier comportant une surface électriquement conductrice qui fait face à une chambre ; n composants électroniques disposés dans l'enceinte, n étant un nombre entier d'au moins 2 et au moins une fraction desdits composants électroniques comportant une surface extérieure électriquement conductrice ; et un adhésif par lequel ladite surface extérieure électriquement conductrice de ladite fraction de composants électroniques est collée à ladite surface électriquement conductrice de la paroi, l'ensemble électronique étant caractérisé en ce que ledit adhésif est obtenu par durcissement d'une composition adhésive électrochimiquement détachable durcissable comprenant : un électrolyte non polymérisable ; un agent de contrôle de rhéologie ; et une résine de matrice.