WO2024052121 - DEBONDABLE SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)
National phase entry is expected:
Publication Number
WO/2024/052121
Publication Date
14.03.2024
International Application No.
PCT/EP2023/073083
International Filing Date
23.08.2023
Title **
[English]
DEBONDABLE SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)
[French]
ADHÉSIF SENSIBLE À LA PRESSION (PSA) À BASE DE SOLVANT DÉCOLLABLE
Applicants **
HENKEL AG & CO. KGAA
Inventors
STAPF, Stefanie
SCHNEIDER, Anja
LIESKE, Alexandra
SUNDERMEIER, Uta
Priority Data
22193899.6
05.09.2022
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1996 | |
| EPO | Filing, Examination, Granting | 8126 | |
| Japan | Filing, Examination, Granting | 2124 | |
| South Korea | Filing, Examination, Granting | 2009 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
18,995
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The present invention relates to a debondable solvent-borne pressure sensitive adhesive composition comprising a) a (meth)acrylate co-polymer formed from the monomers selected from the group consisting of ethyl (meth)acrylate, methyl acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 3-epoxypropyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, hydrogenated polybutadiene(meth)acrylate, glacial acrylic acid, vinyl acetate, and mixtures thereof; b) an electrolyte selected from the group consisting of 1-butyl-3-methylimidazolium bis(trifluoromethylsolfonyl)imide, 1-ethyl-3-vinylimidazolium methanesulfonate, 1-dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, tributyl(ethyl) phosphonium diethyl phosphate, trihexyltetradecylphosphonium bis(trifluoromethylsulfonyl)amide and mixtures thereof; c) a cross- linker; and d) a solvent.[French]
La présente invention concerne une composition adhésive sensible à la pression à base de solvant décollable comprenant a) un copolymère de (méth)acrylate formé à partir des monomères choisis dans le groupe constitué par le (méth)acrylate d'éthyle, l'acrylate de méthyle, le (méth)acrylate de butyle, le (méth)acrylate de 2-éthylhexyle, le (méth)acrylate de 3-époxypropyle, le (méth)acrylate de 2-hydroxyéthyle, le (méth)acrylate de polybutadiène hydrogéné, l'acide acrylique glacial, l'acétate de vinyle et leurs mélanges ; b) un électrolyte choisi dans le groupe constitué par le bis(trifluorométhylsulfonyl)imide de 1-butyl-3-méthylimidazolium, le méthanesulfonate de 1-éthyl-3-vinylimidazolium, le bis(trifluorométhylsulfonyl)imide de 1-dodécyl-3-méthylimidazolium, le diéthylphosphate de tributyl(éthyl)phosphonium, le bis(trifluorométhylsulfonyl)amide de trihexyltétradécylphosphonium et leurs mélanges ; c) un agent de réticulation ; et d) un solvant.