WO2023217823 - Multilayered tape and process for debonding the multilayered tape

National phase entry:
Publication Number WO/2023/217823
Publication Date 16.11.2023
International Application No. PCT/EP2023/062353
International Filing Date 10.05.2023
Title **
[English] Multilayered tape and process for debonding the multilayered tape
[French] BANDE MULTICOUCHE ET PROCÉDÉ DE DÉCOLLEMENT DE LA BANDE MULTICOUCHE
Applicants **
TESA SE Hugo-Kirchberg-Str. 1 22848 Norderstedt, DE
Inventors
WANG, Shuang c/o tesa SE; Hugo-Kirchberg-Str. 1 22848 Norderstedt, DE
Priority Data
22172824.9   11.05.2022   EP
Application details
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Quotation for National Phase entry

Country StagesTotal
China Filing146
EPO Filing, Examination4063
Japan Filing501
South Korea Filing542
USA Filing, Examination1460
MasterCard Visa

Total: 6712

The term for entry into the National Phase has expired. This quotation is for informational purposes only

Abstract[English] ) a laser-translucent adhesive layer. Further, the present invention relates to the process for debonding said multilayered tape. Furthermore, the present invention relates to the use of said multilayered tape in electronic devices, automotive devices, medical devices and dentistry devices.[French] ) une couche adhésive translucide au laser. En outre, la présente invention concerne le procédé de décollement de ladite bande multicouche. En outre, la présente invention concerne l’utilisation de ladite bande multicouche dans des dispositifs électroniques, des dispositifs pour automobiles, des dispositifs médicaux et des dispositifs de dentisterie.
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