WO2023232399 - SNAP-CURE FLEXIBLE ELECTRICALLY CONDUCTIVE ONE COMPONENT (1K) EPOXY ADHESIVE COMPOSITION
National phase entry is expected:
Publication Number
WO/2023/232399
Publication Date
07.12.2023
International Application No.
PCT/EP2023/062226
International Filing Date
09.05.2023
Title **
[English]
SNAP-CURE FLEXIBLE ELECTRICALLY CONDUCTIVE ONE COMPONENT (1K) EPOXY ADHESIVE COMPOSITION
[French]
COMPOSITION ADHÉSIVE ÉPOXY À UN COMPOSANT (1K) ÉLECTROCONDUCTRICE, FLEXIBLE, À DURCISSEMENT PAR ENCLIQUETAGE
Applicants **
HENKEL AG & CO. KGAA
Inventors
MILLER, Peter Joseph
KOHLER, Theresia
BUCKLAND, Daniel
ESTRUGA ORTIGA, Marc
Priority Data
22176293.3
31.05.2022
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2055 | |
| EPO | Filing, Examination, Granting | 8617 | |
| Japan | Filing, Examination, Granting | 2185 | |
| South Korea | Filing, Examination, Granting | 2130 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
20,327
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The present invention relates to an electrically conductive composition comprising a) from 5 to 25% by weight of the total weight of the composition of a cycloaliphatic epoxide resin; b) from 0.05 to 10% by weight of the total weight of the composition of a vinyl ether; c) from 0.1 to 0.45% by weight of the total weight of the composition of an onium salt; d) from 0.01 to 10% by weight of the total weight of the composition of a radical initiator; e) from 45 to 85% by weight of the total weight of the composition of electrically conductive particles; and f) from 0.1 to 10% by weight of the total weight of the composition of an organic solvent. The composition can be used as an adhesive in the electronic applications, especially as an adhesive in the shingle module photovoltaic applications.[French]
La présente invention concerne une composition électroconductrice comprenant a) de 5 à 25 % en poids du poids total de la composition d'une résine époxyde cycloaliphatique ; b) de 0,05 à 10 % en poids du poids total de la composition d'un éther vinylique ; c) de 0,1 à 0,45 % en poids du poids total de la composition d'un sel d'onium ; d) de 0,01 à 10 % en poids du poids total de la composition d'un initiateur radicalaire ; e) de 45 à 85 % en poids du poids total de la composition de particules électroconductrices ; et f) de 0,1 à 10 % en poids du poids total de la composition d'un solvant organique. La composition peut être utilisée en tant qu'adhésif dans les applications électroniques, en particulier en tant qu'adhésif dans les applications photovoltaïques de modules de bardeaux.