WO2023217652 - PROCESS FOR WET-CHEMICAL FORMATION OF A STABLE TIN OXIDE LAYER FOR PRINTED CIRCUIT BOARDS
National phase entry:
Publication Number
WO/2023/217652
Publication Date
16.11.2023
International Application No.
PCT/EP2023/061933
International Filing Date
05.05.2023
Title **
[English]
PROCESS FOR WET-CHEMICAL FORMATION OF A STABLE TIN OXIDE LAYER FOR PRINTED CIRCUIT BOARDS
[French]
PROCÉDÉ DE FORMATION CHIMIQUE PAR VOIE HUMIDE D'UNE COUCHE D'OXYDE D'ÉTAIN STABLE POUR CARTES DE CIRCUITS IMPRIMÉS
Applicants **
ATOTECH DEUTSCHLAND GMBH & CO. KG
Erasmusstraße 20
10553 Berlin, DE
Inventors
SCHACHTNER, Bernhard
c/o Atotech Deutschland GmbH & Co. KG
Intellectual Property
Erasmusstraße 20
10553 Berlin, DE
Priority Data
22172274.7
09.05.2022
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
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| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
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International Searching Authority |
EPO
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Translation |
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Recalculate
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1080 | |
| EPO | Filing, Examination | 4606 | |
| Japan | Filing | 590 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 2710 |
Total: 9561 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
The present invention concerns a process for treating a tin or tin alloy layer onto metal surfaces, preferred copper surfaces, comprising the steps of (i) Providing a metal surface, preferred a copper surface, (ii) Contacting the metal surface, preferred the copper surface, with a tin or tin alloy plating bath; and (iii) Oxidizing the tin or tin alloy layer obtained by step (ii).[French]
La présente invention concerne un procédé de traitement d'une couche d'étain ou d'alliage d'étain sur des surfaces métalliques, des surfaces de cuivre préférées, comprenant les étapes consistant à (i) fournir une surface métallique, de préférence une surface de cuivre, (ii) mettre en contact la surface métallique, de préférence la surface de cuivre, avec un bain de placage d'étain ou d'alliage d'étain ; et (iii) oxyder la couche d'étain ou d'alliage d'étain obtenue à l'étape (ii).