WO2023170021 - ELECTRONIC DEVICE MANUFACTURING SOLUTION, METHOD FOR MANUFACTURING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE
National phase entry:
Publication Number
WO/2023/170021
Publication Date
14.09.2023
International Application No.
PCT/EP2023/055662
International Filing Date
07.03.2023
Title **
[English]
ELECTRONIC DEVICE MANUFACTURING SOLUTION, METHOD FOR MANUFACTURING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE
[French]
SOLUTION DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE, PROCÉDÉ DE FABRICATION DE MOTIF DE RÉSERVE ET PROCÉDÉ DE FABRICATION DE DISPOSITIF
Applicants **
MERCK PATENT GMBH
Frankfurter Strasse 250
64293 Darmstadt, DE
Inventors
YAMAMOTO, Kazuma
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Japan
Shizuoka, 437-1412, JP
YASHIMA, Tomoyasu
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Shizuoka, 437-1412, JP
ISHII, Maki
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Shizuoka, 437-1412, JP
YANAGITA, Hiroshi
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Shizuoka, 437-1412, JP
Priority Data
2022-036381
09.03.2022
JP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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International Searching Authority |
EPO
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
* The data is based on automatic recognition. Please verify and amend if necessary.
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1112 | |
| EPO | Filing, Examination | 4722 | |
| Japan | Filing | 591 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 2710 |

Total: 9710 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
Provided are an electronic device manufacturing solution, a method for manufacturing a resist pattern, and a method for manufacturing a device.[French]
L'invention concerne une solution de fabrication de dispositif électronique, un procédé de fabrication de motif de réserve et un procédé de fabrication de dispositif.