WO2023169968 - METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
National phase entry:
Publication Number
WO/2023/169968
Publication Date
14.09.2023
International Application No.
PCT/EP2023/055527
International Filing Date
06.03.2023
Title **
[English]
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
[French]
PROCÉDÉ DE FABRICATION DE SUBSTRAT TRAITÉ
Applicants **
MERCK PATENT GMBH
Frankfurter Strasse 250
64293 Darmstadt, DE
Inventors
HAYASHI, Masanobu
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Shizuoka, 437-1412, JP
AOKI, Hiroyuki
c/o Merck Electronics Ltd.
3330, Chihama, Kakegawa-shi
Shizuoka, 437-1412, JP
Priority Data
2022-035569
08.03.2022
JP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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International Searching Authority |
EPO
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| Applicant's Legal Status |
Legal Entity
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| * | |
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| Entry into National Phase under |
Chapter I
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| Translation |
|
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1030 | |
| EPO | Filing, Examination | 4601 | |
| Japan | Filing | 591 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 2710 |
Total: 9507 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
[Problem] To provide a method for manufacturing a processed substrate with improved flatness. [Means for Solution] A method for manufacturing a processed substrate comprising the following steps: (a) applying a cured film forming composition on a substrate having grooves in an amount sufficient to fill grooves to form a composition layer; (b) removing the surplus part from the composition layer by scraping off using a separation member to form a substrate surface with improved flatness; and (c) heating the substrate to cure the composition layer in which the surplus part is removed.[French]
Le problème à résoudre par la présente invention est de fournir un procédé de fabrication d'un substrat traité présentant une planéité améliorée. La solution selon l'invention porte sur un procédé de fabrication d'un substrat traité comprenant les étapes suivantes : (a) appliquer une composition filmogène durcie sur un substrat comportant des rainures en quantité suffisante pour remplir les rainures et former une couche de composition ; (b) retirer la partie excédentaire de la couche de composition par grattage à l'aide d'un élément de séparation pour former une surface de substrat présentant une meilleure planéité ; et (c) chauffer le substrat pour durcir la couche de composition dans laquelle la partie excédentaire a été retirée.