WO2023110660 - THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
National phase entry:
Publication Number
WO/2023/110660
Publication Date
22.06.2023
International Application No.
PCT/EP2022/085122
International Filing Date
09.12.2022
Title **
[English]
THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME
[French]
COMPOSITION DE FORMATION DE FILM ÉPAIS ET PROCÉDÉ DE FABRICATION DE FILM DURCI L'UTILISANT
Applicants **
MERCK PATENT GMBH
Frankfurter Strasse 250
64293 Darmstadt, DE
Inventors
NOJIMA, Yoshio
c/o Merck Electronics Ltd.
3330 Chihama
Kakegawa-shi
SHIZUOKA 437-1412, JP
SEKITO, Takashi
c/o Merck Electronics Ltd.
3330 Chihama
Kakegawa-shi
SHIZUOKA 437-1412, JP
HITOKAWA, Hiroshi
c/o Merck Electronics Ltd.
3330 Chihama
Kakegawa-shi
SHIZUOKA 437-1412, JP
KUDO, Takanori
c/o EMD Performance Materials Corp.
1200 Intrepid Ave, Suite 300
Pennsylvania
PHILADELPHIA, PA 19112, US
Priority Data
63/265,315
13.12.2021
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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International Searching Authority |
EPO
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1381 | |
| EPO | Filing, Examination | 6375 | |
| Japan | Filing | 595 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 2710 |
Total: 11636 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
A thick film-forming composition comprising a hydrocarbon- containing compound (A) having a certain structure and a solvent (B): wherein, the solvent (B) comprises an organic solvent (B1) and an organic solvent (B2) having a dielectric constant of 20.0 to 90.0; and the film thickness of the film formed from the thick film-forming composition is 0.5 to 10 μm.[French]
Composition filmogène épaisse comprenant un composé contenant des hydrocarbures (A) ayant une certaine structure et un solvant (B). Le solvant (B) comprend un solvant organique (B1) et un solvant organique (B2) ayant une constante diélectrique de 20,0 à 90,0 ; et l'épaisseur de film du film formé à partir de la composition filmogène épaisse est de 0,5 à 10 µm.