WO2023094141 - HIGHLY CONDUCTIVE FILAMENT FOR FUSED DEPOSITION MODELING
National phase entry:
Publication Number
WO/2023/094141
Publication Date
01.06.2023
International Application No.
PCT/EP2022/081110
International Filing Date
08.11.2022
Title **
[English]
HIGHLY CONDUCTIVE FILAMENT FOR FUSED DEPOSITION MODELING
[French]
FILAMENT HAUTEMENT CONDUCTEUR POUR MODÉLISATION DE DÉPÔT PAR FUSION
Applicants **
KARLSRUHER INSTITUT FÜR TECHNOLOGIE
Kaiserstr. 12
76131 Karlsruhe, DE
Inventors
SUN, Hongye
Reinhold-Frank-Straße 50
76133 Karlsruhe, DE
WILLENBACHER, Norbert
Dr.-Kurt-Schumacherstraße 15
67292 Kirchheimbolanden, DE
WENZHE, Ge
Ebertstraße 8
76137 Karlsruhe, DE
Priority Data
21209981.6
23.11.2021
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| * | |
International Searching Authority |
EPO
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
* The data is based on automatic recognition. Please verify and amend if necessary.
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1191 | |
| EPO | Filing, Examination | 4788 | |
| Japan | Filing | 590 | |
| South Korea | Filing | 575 | |
| USA | Filing, Examination | 5110 |
Total: 12254 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
The present invention relates to a highly conductive filament for Fused Deposition Modeling, to its manufacture using a highly conductive paste based on a capillary suspension and to its use in a Fused Deposition Modeling process.[French]
La présente invention concerne un filament hautement conducteur pour une modélisation par dépôt par fusion, sa fabrication à l'aide d'une pâte hautement conductrice à base d'une suspension capillaire et son utilisation dans un procédé de modélisation par dépôt par fusion.