WO2023057525 - SOURCE WAFER, METHOD, AND OPTOELECTRONIC DEVICES
National phase entry:
Publication Number
WO/2023/057525
Publication Date
13.04.2023
International Application No.
PCT/EP2022/077727
International Filing Date
05.10.2022
Title **
[English]
SOURCE WAFER, METHOD, AND OPTOELECTRONIC DEVICES
[French]
TRANCHE SOURCE, PROCÉDÉ ET DISPOSITIFS OPTOÉLECTRONIQUES
Applicants **
ROCKLEY PHOTONICS LIMITED
Inventors
YANG, Hua
DERNAIKA, Mohamad
PETERS, Frank
YU, Guomin
Priority Data
2114242.7
05.10.2021
GB
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2364 | |
| EPO | Filing, Examination, Granting | 14431 | |
| Japan | Filing, Examination, Granting | 2610 | |
| South Korea | Filing, Examination, Granting | 3019 | |
| USA | Filing, Examination, Granting | 8340 |
Total:
30,764
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Contact Us
Abstract[English]
A source wafer for use in a micro-transfer printing process. The source wafer comprising: a wafer substrate; a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and one or more etch stop layers, located between the photonic component and the wafer substrate.[French]
Tranche source destinée à être utilisée dans un processus d'impression par micro-transfert. La tranche source comprend : un substrat de tranche; un composant photonique, agencé dans un coupon de dispositif, le coupon de dispositif étant fixé au substrat de tranche par l'intermédiaire d'une couche de libération; et une ou plusieurs couches d'arrêt de gravure situées entre le composant photonique et le substrat de tranche.