WO2023020763 - EMI SHIELDING ADHESIVE COMPOSITION AND ITS USE
National phase entry:
Publication Number
WO/2023/020763
Publication Date
23.02.2023
International Application No.
PCT/EP2022/070114
International Filing Date
19.07.2022
Title **
[English]
EMI SHIELDING ADHESIVE COMPOSITION AND ITS USE
[French]
COMPOSITION ADHÉSIVE DE BLINDAGE EMI ET SON UTILISATION
Applicants **
HENKEL AG & CO. KGAA
Inventors
KIKUCHI, Yukari
Priority Data
21191943.6
18.08.2021
EP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1880 | |
| EPO | Filing, Examination, Granting | 8113 | |
| Japan | Filing, Examination, Granting | 1937 | |
| South Korea | Filing, Examination, Granting | 1631 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
18,901
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
An object of the present invention is to provide an acrylic resin-containing adhesive composition having high EMI shielding performance, wherein the composition provides an EMI shielding cured product that has high impact resistant and is sufficiently cured at a low temperature, and when the composition is applied to a metal surface, the adhesion surface has high pull strength. The present invention relates to an EMI shielding adhesive composition comprising (a) a conductive filler, (b) a (meth)acrylic resin, (c) a tackifier, (d) a bismaleimide and (e) a radical initiator.[French]
Un objet de la présente invention est de fournir une composition adhésive contenant une résine acrylique ayant une performance de blindage EMI élevée, la composition fournissant un produit durci de blindage EMI qui a une résistance aux chocs élevée et est suffisamment durci à basse température, et lorsque la composition est appliquée sur une surface métallique, la surface d'adhérence a une résistance à la traction élevée. La présente invention concerne une composition adhésive de blindage EMI comprenant (a) une charge conductrice, (b) une résine (méth)acrylique, (c) un tackifiant, (d) un bismaléimide et (e) un initiateur radicalaire.