WO2023025454 - METHOD FOR DETACHING SUBSTRATES BONDED BY POLYURETHANE ADHESIVE

National phase entry:
Publication Number WO/2023/025454
Publication Date 02.03.2023
International Application No. PCT/EP2022/069543
International Filing Date 13.07.2022
Title **
[English] METHOD FOR DETACHING SUBSTRATES BONDED BY POLYURETHANE ADHESIVE
[French] PROCÉDÉ DE DÉTACHEMENT DE SUBSTRATS LIÉS PAR UN ADHÉSIF DE POLYURÉTHANE
Applicants **
HENKEL AG & CO. KGAA Henkelstrasse 67 40589 Düsseldorf, DE
Inventors
PARK, Gwanghyun 99. Sinsan-ro, Saha-Gu, Busan, 49421, Republic of Korea Busan, 49421, KR
NAM, Arnold Yeonwoo 104-204, Hasinbeonyoung-ro 400, Saha-gu Busan 49302, KR
Priority Data
21192747.0   24.08.2021   EP
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Quotation for National Phase entry

Country StagesTotal
China Filing961
EPO Filing, Examination4598
Japan Filing592
South Korea Filing574
USA Filing, Examination2710
MasterCard Visa

Total: 9435

The term for entry into the National Phase has expired. This quotation is for informational purposes only

Abstract[English] Method for detaching two substrates bonded by a polyurethane adhesive, comprising the steps of: (1) treating a first substrate and a second substrate bonded by a polyurethane adhesive with a debonding agent comprising lactic acid at a temperature from 40°C to 90°C, and (2) separating the first substrate and the second substrate from the polyurethane adhesive.[French] L'invention concerne un procédé de détachement de deux substrats liés par un adhésif de polyuréthane, comprenant les étapes consistant à : (1) traiter un premier substrat et un second substrat liés par un adhésif de polyuréthane avec un agent de décollement comprenant de l'acide lactique à une température de 40 °C à 90 °C, et (2) séparer le premier substrat et le second substrat de l'adhésif de polyuréthane.
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