WO2023046278 - A SPACER, AN ELECTRONIC MODULE, A VEHICLE AND A MANUFACTURING METHOD
National phase entry:
Publication Number
WO/2023/046278
Publication Date
30.03.2023
International Application No.
PCT/EP2021/076074
International Filing Date
22.09.2021
Title **
[English]
A SPACER, AN ELECTRONIC MODULE, A VEHICLE AND A MANUFACTURING METHOD
[French]
ESPACEUR, MODULE ÉLECTRONIQUE, VÉHICULE ET PROCÉDÉ DE FABRICATION
Applicants **
VOLKSWAGEN AKTIENGESELLSCHAFT
Berliner Ring 2
38440 Wolfsburg, DE
Inventors
AAL, Andreas
Wilhelm Raabe-Str. 2
38104 Braunschweig, DE
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| * | |
International Searching Authority |
EPO
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1029 | |
| EPO | Filing, Examination | 4635 | |
| Japan | Filing | 594 | |
| South Korea | Filing | 482 | |
| USA | Filing, Examination | 3310 |
Total: 10050 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
The present invention relates to a spacer, an electronic module, a vehicle and a manufacturing method for an electronic module. The spacer (10; 10a-g) for supporting a printed circuit board (20) in a housing (30) of an electronic module (40) comprises a flexible structure (12) configured to at least partly decouple the printed circuit board (20) from the housing (30) mechanically. The flexible structure (12) is further configured to thermally couple the printed circuit board (20) and the housing (30) for heat absorption from the printed circuit board (20) towards the housing (30).[French]
La présente invention concerne un espaceur, un module électronique, un véhicule et un procédé de fabrication d'un module électronique. L'espaceur (10 ; 10a-g) pour supporter une carte de circuit imprimé (20) dans un boîtier (30) d'un module électronique (40) comprend une structure souple (12) conçue pour découpler au moins partiellement la carte de circuit imprimé (20) du boîtier (30) mécaniquement. La structure souple (12) est en outre conçue pour coupler thermiquement la carte de circuit imprimé (20) et le boîtier (30) pour une absorption de chaleur à partir de la carte de circuit imprimé (20) vers le boîtier (30).