WO2026097830 - MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

National phase entry is expected:
Publication Number WO/2026/097830
Publication Date 15.05.2026
International Application No. PCT/CN2025/096881
International Filing Date 23.05.2025
Title **
[English] MICRO LED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
[French] PANNEAU D'AFFICHAGE MICRO-LED, SON PROCÉDÉ DE FABRICATION ET DISPOSITIF D'AFFICHAGE
Applicants **
JADE BIRD DISPLAY (SHANGHAI) LIMITED
Inventors
CHEN, Peng
Priority Data
PCT/CN2024/130424   07.11.2024   CN
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Translation

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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2335
EPO Filing, Examination, Granting22271
Japan Filing, Examination, Granting2801
South Korea Filing, Examination, Granting3532
USA Filing, Examination, Granting7940
MasterCard Visa
Total: 38,879
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Abstract[English] A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer; a micro LED array disposed on the driving layer; and a transparent protective layer disposed on the micro LED array, wherein the driving layer is configured to receive signals for driving the micro LED array; a flexible circuit board (FCB) disposed adjacent to the micro LED chip and configured to couple to the micro LED chip; and a molded layer disposed to join the micro LED chip and the FCB together.[French] L'invention concerne un élément micro-LED, un panneau d'affichage micro-LED et un dispositif d'affichage. Le panneau d'affichage micro-LED comprend une puce micro-LED comprenant une couche de commande ; un réseau de micro-LED disposé sur la couche de commande ; et une couche de protection transparente disposée sur le réseau de micro-LED, la couche de commande étant configurée pour recevoir des signaux pour entraîner le réseau de micro-LED ; une carte de circuit imprimé souple (FCB) disposée adjacente à la puce micro-LED et configurée pour se coupler à la puce micro-LED ; et une couche moulée disposée pour relier la puce micro-LED et la FCB ensemble.

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