WO2025251239 - BONE CONDUCTION MEMS CHIP AND MANUFACTURING METHOD THEREFOR, AND BONE CONDUCTION PACKAGING STRUCTURE HAVING BONE CONDUCTION MEMS CHIP
National phase entry is expected:
Publication Number
WO/2025/251239
Publication Date
11.12.2025
International Application No.
PCT/CN2024/097643
International Filing Date
06.06.2024
Title **
[English]
BONE CONDUCTION MEMS CHIP AND MANUFACTURING METHOD THEREFOR, AND BONE CONDUCTION PACKAGING STRUCTURE HAVING BONE CONDUCTION MEMS CHIP
[French]
PUCE MEMS À CONDUCTION OSSEUSE ET SON PROCÉDÉ DE FABRICATION, ET STRUCTURE D'ENCAPSULATION DE CONDUCTION OSSEUSE AYANT UNE PUCE MEMS À CONDUCTION OSSEUSE
[Chinese]
骨传导MEMS芯片及其制造方法、具有该骨传导MEMS芯片的骨传导封装结构
Applicants **
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
Inventors
WANG, Kaijie
LI, Bo
ZHANG, Rui
Application details
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1503 | |
| EPO | Filing, Examination, Granting | 11576 | |
| Japan | Filing, Examination, Granting | 2001 | |
| South Korea | Filing, Examination, Granting | 1713 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
21,533
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Abstract[English]
The present invention provides a bone conduction MEMS chip and a manufacturing method therefor, and a bone conduction packaging structure having the bone conduction MEMS chip. The bone conduction MEMS chip comprises: a substrate provided with a cavity, a diaphragm supported on the substrate, and a back plate spaced apart from the side of the diaphragm distant from the substrate, wherein a mass block is arranged on the side of the diaphragm distant from the back plate. The mass block in the bone conduction MEMS chip of the present invention is directly formed on the diaphragm, and the bone conduction packaging structure avoids additionally providing a vibration sheet and a mass block, thereby reducing costs, achieving simple packaging, and allowing the structure to be smaller.[French]
La présente invention concerne une puce MEMS à conduction osseuse et son procédé de fabrication, et une structure d'encapsulation de conduction osseuse comportant la puce MEMS à conduction osseuse. La puce MEMS à conduction osseuse comprend : un substrat pourvu d'une cavité, d'une membrane supportée sur le substrat, et d'une plaque arrière espacée du côté de la membrane distante du substrat, un bloc de masse étant disposé sur le côté de la membrane distante de la plaque arrière. Le bloc de masse dans la puce MEMS à conduction osseuse de la présente invention est directement formé sur la membrane, et la structure d'encapsulation de conduction osseuse évite en outre la fourniture d'une feuille de vibration et d'un bloc de masse, ce qui permet de réduire les coûts, d'obtenir une encapsulation simple, et de permettre à la structure d'être plus petite.[Chinese]
本发明提供了一种骨传导MEMS芯片及其制造方法，以及具有该骨传导MEMS芯片的骨传导封装结构，骨传导MEMS芯片包括：包括具有腔体的衬底、支撑于衬底上的振膜以及间隔设置于振膜远离衬底一侧的背板，振膜远离背板的一侧设置有质量块。本发明的骨传导MEMS芯片中质量块直接形成在振膜上，骨传导封装结构避免另外设置振动片及质量块，成本降低，封装也简单，结构也可以更小。