WO2025123276 - EMBEDDED POWER PACKAGE
National phase entry is expected:
Publication Number
WO/2025/123276
Publication Date
19.06.2025
International Application No.
PCT/CN2023/138732
International Filing Date
14.12.2023
Title **
[English]
EMBEDDED POWER PACKAGE
[French]
BOÎTIER D'ALIMENTATION INTÉGRÉ
Applicants **
HUAWEI TECHNOLOGIES CO., LTD.
Inventors
PALM, Lasse Petteri
TORWESTEN, Holger
LIU, Chunlei
MUNDING, Andreas
HE, Zhengyan
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
CNIPA
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1647 | |
| EPO | Filing, Examination, Granting | 11558 | |
| Japan | Filing, Examination, Granting | 2153 | |
| South Korea | Filing, Examination, Granting | 2044 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
22,142
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
An embedded power package (100) is disclosed. The embedded power package (100) comprises a PCB (110) comprising one or more embedded electronic components (111, 112) and a metallization layer (120) to electrically connect the one or more embedded electronic components (111, 112). The PCB (110) comprises a power section (101) in which one or more embedded electronic components (111, 112) are embedded and in which a first part (120a) of the metallization layer (120) is arranged. The embedded power package (100) comprises a metal layer reinforcement (130) enforcing the first part (120a) of the metallization layer (120). The metal layer reinforcement (130) is configured to increase a current carrying capability and/or a thermal mass of the first part (120a) of the metallization layer (120) for carrying a current of the one or more embedded electronic components (111, 112).[French]
Un boîtier d'alimentation intégré (100) est divulgué. Le boîtier d'alimentation intégré (100) comprend une PCB (110) comprenant un ou plusieurs composants électroniques intégrés (111, 112) et une couche de métallisation (120) pour connecter électriquement le ou les composants électroniques intégrés (111, 112). La PCB (110) comprend une section d'alimentation (101) dans laquelle un ou plusieurs composants électroniques intégrés (111, 112) sont intégrés et dans laquelle une première partie (120a) de la couche de métallisation (120) est disposée. Le boîtier d'alimentation intégré (100) comprend un renforcement de couche métallique (130) appliquant la première partie (120a) de la couche de métallisation (120). Le renforcement de couche métallique (130) est configuré pour augmenter une capacité de transport de courant et/ou une masse thermique de la première partie (120a) de la couche de métallisation (120) pour transporter un courant du ou des composants électroniques intégrés (111, 112).