WO2023142143 - MICRO LED, MICRO LED ARRAY PANEL AND MANUFACUTURING METHOD THEREOF

National phase entry:
Publication Number WO/2023/142143
Publication Date 03.08.2023
International Application No. PCT/CN2022/075285
International Filing Date 31.01.2022
Title **
[English] MICRO LED, MICRO LED ARRAY PANEL AND MANUFACUTURING METHOD THEREOF
[French] MICRO-DEL, PANNEAU DE RÉSEAU DE MICRO-DEL ET SON PROCÉDÉ DE FABRICATION
Applicants **
JADE BIRD DISPLAY (SHANGHAI) LIMITED 7F, No. 11, 13, Lane 99, Haiyang 4th Road, Lin-gang Special Area, China (Shanghai) Pilot Free Trade Zone Pudong New Area, Shanghai 201306, CN
Inventors
ZHU, Yuankun 7F, No. 11, 13, Lane 99, Haiyang 4th Road, Lin-gang Special Area, China (Shanghai) Pilot Free Trade Zone Pudong New Area, Shanghai 201306, CN
FANG, Anle 7F, No. 11, 13, Lane 99, Haiyang 4th Road, Lin-gang Special Area, China (Shanghai) Pilot Free Trade Zone Pudong New Area, Shanghai 201306, CN
LIU, Deshuai 7F, No. 11, 13, Lane 99, Haiyang 4th Road, Lin-gang Special Area, China (Shanghai) Pilot Free Trade Zone Pudong New Area, Shanghai 201306, CN
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Quotation for National Phase entry

Country StagesTotal
China Filing6095
EPO Filing, Examination137553
Japan Filing594
South Korea Filing482
USA Filing, Examination41560
MasterCard Visa

Total: 186284

The term for entry into the National Phase has expired. This quotation is for informational purposes only

Abstract[English] A micro LED includes a first type semiconductor layer; and a light emitting layer formed on the first type semiconductor layer; wherein the first type semiconductor layer includes a mesa structure, a trench, and anion implantation fence separated from the mesa structure by the trench, wherein the ion implantation fence is formed around the trench, the trench is formed around the mesa structure; and an electrical resistance of the ion implantation fence is higher than an electrical resistance of the mesa structure.[French] La présente invention concerne une micro LED qui comprend une couche semi-conductrice de premier type et une couche électroluminescente formée sur la couche semi-conductrice de premier type. La couche semi-conductrice de premier type comprend une structure mésa, une tranchée et une barrière d'implantation ionique séparée de la structure mésa par la tranchée, la barrière d'implantation ionique étant formée autour de la tranchée, la tranchée étant formée autour de la structure mésa, et la résistance électrique de la barrière d'implantation ionique étant supérieure à celle de la structure mésa.
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