WO2023087210 - DRIVING APPARATUS, DISPLAY APPARATUS, AND METHOD OF FABRICATING DRIVING APPARATUS

National phase entry:
Publication Number WO/2023/087210
Publication Date 25.05.2023
International Application No. PCT/CN2021/131476
International Filing Date 18.11.2021
Title **
[English] DRIVING APPARATUS, DISPLAY APPARATUS, AND METHOD OF FABRICATING DRIVING APPARATUS
[French] APPAREIL DE PILOTAGE, APPAREIL D'AFFICHAGE ET PROCÉDÉ DE FABRICATION D'APPAREIL DE PILOTAGE
Applicants **
BOE TECHNOLOGY GROUP CO., LTD. No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
Inventors
LI, Tianji No.9 Dize Rd., BDA Beijing 100176, CN
YANG, Fei No.9 Dize Rd., BDA Beijing 100176, CN
CHU, Mingi No.9 Dize Rd., BDA Beijing 100176, CN
CHEN, Yi No.9 Dize Rd., BDA Beijing 100176, CN
WANG, Lirong No.9 Dize Rd., BDA Beijing 100176, CN
WANG, Yu No.9 Dize Rd., BDA Beijing 100176, CN
DONG, Zhiqiang No.9 Dize Rd., BDA Beijing 100176, CN
XU, Jingbo No.9 Dize Rd., BDA Beijing 100176, CN
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Quotation for National Phase entry

Country StagesTotal
China Filing1163
EPO Filing, Examination7996
Japan Filing590
South Korea Filing482
USA Filing, Examination2710
MasterCard Visa

Total: 12941

The term for entry into the National Phase has expired. This quotation is for informational purposes only

Abstract[English] A driving apparatus and a display apparatus are provided. The driving apparatus includes an integrated circuit chip (IC); an input wiring pattern (IWP) connected to the integrated circuit chip (IC), and configured to be connected to a circuit board (CB); and an output wiring pattern (OWP) including a plurality of output wires (OW) connected to the integrated circuit chip (IC), and configured to be connected to a display panel (DP). The plurality of output wires (OW) are arranged in a first bonding region (BR1), at least two output wires of the plurality of output wires (OW) have different average line widths.[French] L'invention concerne un appareil de pilotage et un appareil d'affichage. L'appareil de pilotage comprend une puce de circuit intégré (IC) ; un motif de câblage d'entrée (IWP) connecté à la puce de circuit intégré (IC), et configuré pour être connecté à une carte de circuit imprimé (CB) ; et un motif de câblage de sortie (OWP) comprenant une pluralité de fils de sortie (OW) connectés à la puce de circuit intégré (IC), et configuré pour être connecté à un panneau d'affichage (DP). La pluralité de fils de sortie (OW) sont agencés dans une première région de collage (BR1), au moins deux fils de sortie de la pluralité de fils de sortie (OW) ont des largeurs moyennes de ligne différentes.
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