WO2023082069 - SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS AND METHOD

National phase entry:
Publication Number WO/2023/082069
Publication Date 19.05.2023
International Application No. PCT/CN2021/129658
International Filing Date 09.11.2021
Title **
[English] SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS AND METHOD
[French] DISPOSITIF D'IMAGERIE À SEMI-CONDUCTEURS, APPAREIL ÉLECTRONIQUE ET PROCÉDÉ
Applicants **
HUAWEI TECHNOLOGIES CO., LTD.
Inventors
TAKAHASHI, Seiji
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting1992
EPO Filing, Examination, Granting15280
Japan Filing, Examination, Granting2469
South Korea Filing, Examination, Granting2590
USA Filing, Examination, Granting6340
MasterCard Visa
Total: 28,671

The term for entry into the National Phase has expired. This quotation is for informational purposes only

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Abstract[English] A solid-state imaging device including: a photoelectric conversion part of a first conductivity type semiconductor, including a first side as an electromagnetic wave-incident side and a second side opposite the first side; an epitaxial layer being formed in a side portion of the photoelectric conversion part, and being placed apart from a first plane (A) (A) through the first side; and a separation layer being formed opposite the photoelectric conversion part with respect to the epitaxial layer.[French] L'invention concerne un dispositif d'imagerie à semi-conducteurs comprenant: une partie de conversion photoélectrique d'un semi-conducteur d'un premier type de conductivité, comprenant un premier côté en tant que côté d'incidence d'ondes électromagnétiques et un second côté opposé au premier côté; une couche épitaxiale étant formée dans une partie latérale de la partie de conversion photoélectrique, et étant espacée d'un premier plan (A) (A) à travers le premier côté; et une couche de séparation étant formée à l'opposé de la partie de conversion photoélectrique par rapport à la couche épitaxiale.