WO2023082069 - SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS AND METHOD
National phase entry:
Publication Number
WO/2023/082069
Publication Date
19.05.2023
International Application No.
PCT/CN2021/129658
International Filing Date
09.11.2021
Title **
[English]
SOLID-STATE IMAGING DEVICE, ELECTRONIC APPARATUS AND METHOD
[French]
DISPOSITIF D'IMAGERIE À SEMI-CONDUCTEURS, APPAREIL ÉLECTRONIQUE ET PROCÉDÉ
Applicants **
HUAWEI TECHNOLOGIES CO., LTD.
Huawei Administration Building, Bantian, Longgang District
Shenzhen, Guangdong 518129, CN
Inventors
TAKAHASHI, Seiji
19F, Concurred-Yokohama, 3-1, Kinko-Cho, Kanagawa-Ku
Yokohama, Kanagawa 221-0056, JP
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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International Searching Authority |
CNIPA
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Translation |
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Recalculate
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1350 | |
| EPO | Filing, Examination | 8880 | |
| Japan | Filing | 588 | |
| South Korea | Filing | 482 | |
| USA | Filing, Examination | 4310 |

Total: 15610 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
A solid-state imaging device including: a photoelectric conversion part of a first conductivity type semiconductor, including a first side as an electromagnetic wave-incident side and a second side opposite the first side; an epitaxial layer being formed in a side portion of the photoelectric conversion part, and being placed apart from a first plane (A) (A) through the first side; and a separation layer being formed opposite the photoelectric conversion part with respect to the epitaxial layer.[French]
L'invention concerne un dispositif d'imagerie à semi-conducteurs comprenant: une partie de conversion photoélectrique d'un semi-conducteur d'un premier type de conductivité, comprenant un premier côté en tant que côté d'incidence d'ondes électromagnétiques et un second côté opposé au premier côté; une couche épitaxiale étant formée dans une partie latérale de la partie de conversion photoélectrique, et étant espacée d'un premier plan (A) (A) à travers le premier côté; et une couche de séparation étant formée à l'opposé de la partie de conversion photoélectrique par rapport à la couche épitaxiale.