WO2023065062 - ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD

National phase entry:
Publication Number WO/2023/065062
Publication Date 27.04.2023
International Application No. PCT/CN2021/124320
International Filing Date 18.10.2021
Title **
[English] ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD
[French] SUBSTRAT DE RÉSEAU, APPAREIL D'AFFICHAGE ET PLOT DE CONNEXION
Applicants **
BOE TECHNOLOGY GROUP CO., LTD.
Inventors
WANG, Guoying
XU, Pan
ZHANG, Dacheng
ZHANG, Xing
HAN, Ying
LUO, Chengyuan
SONG, Zhen
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting1899
EPO Filing, Examination, Granting14168
Japan Filing, Examination, Granting2445
South Korea Filing, Examination, Granting2591
USA Filing, Examination, Granting4940
MasterCard Visa
Total: 26,043

The term for entry into the National Phase has expired. This quotation is for informational purposes only

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Abstract[English] An array substrate having a connection pad in a connection pad area is provided. The connection pad includes a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively; the plurality of first connection lines and the plurality of second connection lines being in two different layers. A total number of conductive layers electrically connected to a respective first connection line of the plurality of first connection lines is different from a total number of conductive layers electrically connected to a respective second connection line of the plurality of second connection lines.[French] Est prévu un substrat de réseau possédant un plot de connexion dans une zone de plot de connexion. Le plot de connexion comprend une pluralité de premiers plots de contact de sonde, une pluralité de seconds plots de contact de sonde, une pluralité de premières lignes de connexion couplées à la pluralité de premiers plots de contact de sonde, respectivement, et une pluralité de secondes lignes de connexion couplées à la pluralité de seconds plots de contact de sonde, respectivement ; la pluralité de premières lignes de connexion et la pluralité de secondes lignes de connexion se trouvant dans deux couches différentes. Un nombre total de couches conductrices électriquement connectées à une première ligne de connexion respective de la pluralité de premières lignes de connexion est différent d'un nombre total de couches conductrices électriquement connectées à une seconde ligne de connexion respective de la pluralité de secondes lignes de connexion.