WO2023065062 - ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD
National phase entry:
Publication Number
WO/2023/065062
Publication Date
27.04.2023
International Application No.
PCT/CN2021/124320
International Filing Date
18.10.2021
Title **
[English]
ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD
[French]
SUBSTRAT DE RÉSEAU, APPAREIL D'AFFICHAGE ET PLOT DE CONNEXION
Applicants **
BOE TECHNOLOGY GROUP CO., LTD.
No.10 Jiuxianqiao Rd., Chaoyang District
Beijing 100015, CN
Inventors
WANG, Guoying
No.9 Dize Rd., BDA
Beijing 100176, CN
XU, Pan
No.9 Dize Rd., BDA
Beijing 100176, CN
ZHANG, Dacheng
No.9 Dize Rd., BDA
Beijing 100176, CN
ZHANG, Xing
No.9 Dize Rd., BDA
Beijing 100176, CN
HAN, Ying
No.9 Dize Rd., BDA
Beijing 100176, CN
LUO, Chengyuan
No.9 Dize Rd., BDA
Beijing 100176, CN
SONG, Zhen
No.9 Dize Rd., BDA
Beijing 100176, CN
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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International Searching Authority |
CNIPA
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1266 | |
| EPO | Filing, Examination | 9256 | |
| Japan | Filing | 589 | |
| South Korea | Filing | 482 | |
| USA | Filing, Examination | 2910 |
Total: 14503 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
An array substrate having a connection pad in a connection pad area is provided. The connection pad includes a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively; the plurality of first connection lines and the plurality of second connection lines being in two different layers. A total number of conductive layers electrically connected to a respective first connection line of the plurality of first connection lines is different from a total number of conductive layers electrically connected to a respective second connection line of the plurality of second connection lines.[French]
Est prévu un substrat de réseau possédant un plot de connexion dans une zone de plot de connexion. Le plot de connexion comprend une pluralité de premiers plots de contact de sonde, une pluralité de seconds plots de contact de sonde, une pluralité de premières lignes de connexion couplées à la pluralité de premiers plots de contact de sonde, respectivement, et une pluralité de secondes lignes de connexion couplées à la pluralité de seconds plots de contact de sonde, respectivement ; la pluralité de premières lignes de connexion et la pluralité de secondes lignes de connexion se trouvant dans deux couches différentes. Un nombre total de couches conductrices électriquement connectées à une première ligne de connexion respective de la pluralité de premières lignes de connexion est différent d'un nombre total de couches conductrices électriquement connectées à une seconde ligne de connexion respective de la pluralité de secondes lignes de connexion.