WO2023039701 - 3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING

National phase entry:
Publication Number WO/2023/039701
Publication Date 23.03.2023
International Application No. PCT/CN2021/118132
International Filing Date 14.09.2021
Title **
[English] 3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING
[French] IMPRESSION 3D (TRIDIMENSIONNELLE) AVEC REMPLISSAGE DE VIDE
Applicants **
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD. B507, Block A and B, Nanshan Medical Device Industrial Park Nanhai Avenue 1019, Nanshan District Shenzhen, Guangdong 518000, CN
Inventors
CAO, Peiyan Suite 201, Building B52, Tanglang Industrial Area, No. 13 At No. Five Xinyi Road, Tanglang Community, Taoyuan Str., Nanshan District Shenzhen, Guangdong 518071, CN
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Quotation for National Phase entry

Country StagesTotal
China Filing1173
EPO Filing, Examination7951
Japan Filing588
South Korea Filing482
USA Filing, Examination2710
MasterCard Visa

Total: 12904

The term for entry into the National Phase has expired. This quotation is for informational purposes only

Abstract[English] Disclosed herein is a 3D (3-dimensional) printing method. The method comprises: printing a first layer; locating a first unintended void in the first layer based on an image of the first layer; filling the first unintended void; and printing a second layer on the first layer after said filling the first unintended void is performed.[French] Est divulgué dans la description un procédé d'impression 3D (tridimensionnelle). Le procédé comprend : l'impression d'une première couche ; la localisation d'un premier vide involontaire dans la première couche sur la base d'une image de la première couche ; le remplissage du premier vide involontaire ; et l'impression d'une seconde couche sur la première couche après exécution dudit remplissage du premier vide involontaire.
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