WO2023039701 - 3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING
National phase entry:
Publication Number
WO/2023/039701
Publication Date
23.03.2023
International Application No.
PCT/CN2021/118132
International Filing Date
14.09.2021
Title **
[English]
3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING
[French]
IMPRESSION 3D (TRIDIMENSIONNELLE) AVEC REMPLISSAGE DE VIDE
Applicants **
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
B507, Block A and B, Nanshan Medical Device Industrial Park
Nanhai Avenue 1019, Nanshan District
Shenzhen, Guangdong 518000, CN
Inventors
CAO, Peiyan
Suite 201, Building B52, Tanglang Industrial Area, No. 13 At No. Five Xinyi Road, Tanglang Community, Taoyuan Str., Nanshan District
Shenzhen, Guangdong 518071, CN
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| * | |
International Searching Authority |
CNIPA
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Translation |
|
Recalculate
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing | 1173 | |
| EPO | Filing, Examination | 7951 | |
| Japan | Filing | 588 | |
| South Korea | Filing | 482 | |
| USA | Filing, Examination | 2710 |

Total: 12904 USD
The term for entry into the National Phase has expired. This quotation is for informational purposes only
Abstract[English]
Disclosed herein is a 3D (3-dimensional) printing method. The method comprises: printing a first layer; locating a first unintended void in the first layer based on an image of the first layer; filling the first unintended void; and printing a second layer on the first layer after said filling the first unintended void is performed.[French]
Est divulgué dans la description un procédé d'impression 3D (tridimensionnelle). Le procédé comprend : l'impression d'une première couche ; la localisation d'un premier vide involontaire dans la première couche sur la base d'une image de la première couche ; le remplissage du premier vide involontaire ; et l'impression d'une seconde couche sur la première couche après exécution dudit remplissage du premier vide involontaire.