WO2023039701 - 3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING

National phase entry:
Publication Number WO/2023/039701
Publication Date 23.03.2023
International Application No. PCT/CN2021/118132
International Filing Date 14.09.2021
Title **
[English] 3D (3-DIMENSIONAL) PRINTING WITH VOID FILLING
[French] IMPRESSION 3D (TRIDIMENSIONNELLE) AVEC REMPLISSAGE DE VIDE
Applicants **
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
Inventors
CAO, Peiyan
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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting1816
EPO Filing, Examination, Granting13494
Japan Filing, Examination, Granting2408
South Korea Filing, Examination, Granting2521
USA Filing, Examination, Granting4740
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Total: 24,979

The term for entry into the National Phase has expired. This quotation is for informational purposes only

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Abstract[English] Disclosed herein is a 3D (3-dimensional) printing method. The method comprises: printing a first layer; locating a first unintended void in the first layer based on an image of the first layer; filling the first unintended void; and printing a second layer on the first layer after said filling the first unintended void is performed.[French] Est divulgué dans la description un procédé d'impression 3D (tridimensionnelle). Le procédé comprend : l'impression d'une première couche ; la localisation d'un premier vide involontaire dans la première couche sur la base d'une image de la première couche ; le remplissage du premier vide involontaire ; et l'impression d'une seconde couche sur la première couche après exécution dudit remplissage du premier vide involontaire.