WO2026139869 - MICROPLATING FOR INTEGRATION OF MICRO DEVICES INTO SYSTEM SUBSTRATE
National phase entry is expected:
Publication Number
WO/2026/139869
Publication Date
02.07.2026
International Application No.
PCT/IB2025/063358
International Filing Date
23.12.2025
Title **
[English]
MICROPLATING FOR INTEGRATION OF MICRO DEVICES INTO SYSTEM SUBSTRATE
[French]
MICROPLACAGE POUR L'INTÉGRATION DE MICRO-DISPOSITIFS DANS UN SUBSTRAT DE SYSTÈME
Applicants **
VUEREAL INC.
Inventors
CHAJI, Gholamreza
Priority Data
63/738,023
23.12.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
CIPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| 译文 |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2495 | |
| EPO | Filing, Examination, Granting | 18252 | |
| Japan | Filing, Examination, Granting | 2626 | |
| South Korea | Filing, Examination, Granting | 3108 | |
| USA | Filing, Examination, Granting | 8740 |
Total:
35,221
Contact Us
Abstract[English]
The present invention discloses a method and a system in a microdevice transfer setup. In particular it describes, where the micro devices are on a donor substrate with bonding pads and micro bonding plates. In addition, it describes when there is a system substrate including traces, driving system, bonding pads and micro bonding plate. Further use of electroplating and an electrochemically assisted bonding process is discussed.[French]
La présente invention concerne un procédé et un système dans une configuration de transfert de microdispositif. En particulier, l'invention concerne, lorsque les micro-dispositifs se trouvent sur un substrat donneur avec des plots de liaison et des micro-plaques de liaison. De plus, il décrit lorsqu'il y a un substrat de système comprenant des traces, un système d'entraînement, des plots de liaison et une micro-plaque de liaison. L'invention concerne en outre l'utilisation de l'électrodéposition et un processus de liaison assisté électrochimiquement.