WO2025215573 - METHOD FOR CONTROLLING A WET ETCHING PROCESS
National phase entry is expected:
Publication Number
WO/2025/215573
Publication Date
16.10.2025
International Application No.
PCT/IB2025/053770
International Filing Date
10.04.2025
Title **
[English]
METHOD FOR CONTROLLING A WET ETCHING PROCESS
[French]
PROCÉDÉ DE COMMANDE D'UN PROCESSUS DE GRAVURE HUMIDE
Applicants **
NEXGEN WAFER SYSTEMS PTE. LTD.
Inventors
HUBER, Martin
IBRAHIM, Hazem
SANCHEZ, Daniel
Priority Data
24169465.2
10.04.2024
EP
Application details
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2171 | |
| EPO | Filing, Examination, Granting | 10656 | |
| Japan | Filing, Examination, Granting | 2307 | |
| South Korea | Filing, Examination, Granting | 2380 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
22,854
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Abstract[English]
The disclosure relates to a method (200) for controlling a wet etching process (131, 132, 133), the wet etching process (131, 132, 133) using a chemical liquid (18) comprising one or more chemical etchants for etching specimens (1), the method (200) comprising: – obtaining measurement data indicative of a material removal, a thickness and/or a surface roughness of one or more of the specimens (1) etched by the chemical liquid (18); and – obtaining control data for controlling one or more settings of the wet etching process (131, 132, 133) based on the measurement data.[French]
L'invention concerne un procédé (200) de commande d'un processus (131, 132, 133) de gravure humide, le processus (131, 132, 133) de gravure humide utilisant un liquide chimique (18) comprenant un ou plusieurs agents de gravure chimiques destinés à graver des échantillons (1), le procédé (200) comprenant : – l’obtention de données de mesure indiquant un enlèvement de matière, une épaisseur et/ou une rugosité de surface d'un ou plusieurs des échantillons (1) gravés par le liquide chimique (18) ; et – l’obtention de données de commande servant à commander un ou plusieurs réglages du processus (131, 132, 133) de gravure humide d’après les données de mesure.