WO2025210564 - DECOMPOSABLE POLYMER IN MICROSOLID PRINTING PROCESS
National phase entry is expected:
Publication Number
WO/2025/210564
Publication Date
09.10.2025
International Application No.
PCT/IB2025/053536
International Filing Date
03.04.2025
Title **
[English]
DECOMPOSABLE POLYMER IN MICROSOLID PRINTING PROCESS
[French]
POLYMÈRE DÉCOMPOSABLE DANS UN PROCÉDÉ D'IMPRESSION MICROSOLIDE
Applicants **
VUEREAL INC.
Inventors
CHAJI, Gholamreza
Priority Data
63/575,512
05.04.2024
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
CIPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2795 | |
| EPO | Filing, Examination, Granting | 21825 | |
| Japan | Filing, Examination, Granting | 2742 | |
| South Korea | Filing, Examination, Granting | 3401 | |
| USA | Filing, Examination, Granting | 8740 |
Total:
39,503
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Abstract[English]
The present disclosure relates to integrating micro-semiconductor devices into a system substrate using a decomposable polymer. In at least one implementation, a method includes metalizing a substrate by mixing metal powders in the decomposable polymer under light or temperature; patterning using a printing process; and decomposing the decomposable polymer to sinter the metal powders.[French]
La présente divulgation concerne l'intégration de dispositifs à micro-semi-conducteurs dans un substrat de système à l'aide d'un polymère décomposable. Dans au moins un mode de réalisation, un procédé comprend la métallisation d'un substrat par mélange de poudres métalliques dans le polymère décomposable sous l'effet de la lumière ou de la température ; la formation d'un motif à l'aide d'un procédé d'impression ; et la décomposition du polymère décomposable pour fritter les poudres métalliques.