WO2023062488 - FOOTWELL HEATING MODULE
National phase entry:
Publication Number
WO/2023/062488
Publication Date
20.04.2023
International Application No.
PCT/IB2022/059564
International Filing Date
06.10.2022
Title **
[English]
FOOTWELL HEATING MODULE
[French]
MODULE DE CHAUFFAGE D'ESPACE POUR LES PIEDS
Applicants **
GENTHERM GMBH
Inventors
GANSTER, Peter Edward
Priority Data
63/255,114
13.10.2021
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2010 | |
| EPO | Filing, Examination, Granting | 8746 | |
| Japan | Filing, Examination, Granting | 2186 | |
| South Korea | Filing, Examination, Granting | 2127 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
19,809
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A heating module and a vehicle and vehicle seat comprising the same. The heating module comprises a housing and a printed circuit board assembly. The housing comprises a printed circuit board assembly portion and a heating element portion. The printed circuit board assembly is located within the printed circuit board assembly portion. One or more heating elements are located within the heating element portion. An airflow is provided to the printed circuit board assembly portion by a fluid moving device to draw heat from the printed circuit board assembly.[French]
Module de chauffage et véhicule et siège de véhicule comprenant ledit module de chauffage. Le module de chauffage comprend un boîtier et un ensemble carte de circuit imprimé. Le boîtier comprend une partie ensemble carte de circuit imprimé et une partie élément chauffant. L'ensemble carte de circuit imprimé est situé à l'intérieur de la partie ensemble carte de circuit imprimé. Un ou plusieurs éléments chauffants sont situés à l'intérieur de la partie élément chauffant. Un flux d'air est fourni à la partie ensemble carte de circuit imprimé par un dispositif de déplacement de fluide pour aspirer la chaleur de l'ensemble carte de circuit imprimé.