WO2026125110 - THERMAL INTERFACE MATERIAL FOR HIGH VOLTAGE APPLICATION
National phase entry is expected:
Publication Number
WO/2026/125110
Publication Date
18.06.2026
International Application No.
PCT/EP2025/085358
International Filing Date
03.12.2025
Title **
[English]
THERMAL INTERFACE MATERIAL FOR HIGH VOLTAGE APPLICATION
[French]
MATÉRIAU D'INTERFACE THERMIQUE POUR APPLICATION HAUTE TENSION
Applicants **
HENKEL AG & CO. KGAA
Inventors
SCHUH, Holger
SCHIMMECK, Frederic
RIEM, Nicolas
WHITE, Kevin
Priority Data
63/730,260
10.12.2024
US
Application details
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2024 | |
| EPO | Filing, Examination, Granting | 8126 | |
| Japan | Filing, Examination, Granting | 2155 | |
| South Korea | Filing, Examination, Granting | 2071 | |
| USA | Filing, Examination, Granting | 5340 |
Total:
19,716
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Abstract[English]
The present invention relates to a thermal interface material structure for high voltage application, in particular for high voltage power system and to a method of producing the thermal interface material structure. Further, the present invention relates to an electronic apparatus comprising the thermal interface material structure and to a method of manufacturing the electronic apparatus. The thermal interface material structure, comprises in sequence: a gap filler layer, a thermal pad layer, and an adhesive layer having a first adhesion strength to metal of from 50 to 1000 g/in, measured according to ASTM D3330/D3330M Method A and having a second adhesion strength to the thermal pad layer of at least 10% larger than the first adhesion strength.[French]
La présente invention concerne une structure de matériau d'interface thermique pour une application haute tension, en particulier pour un système d'alimentation haute tension et un procédé de production de la structure de matériau d'interface thermique. En outre, la présente invention concerne un appareil électronique comprenant la structure de matériau d'interface thermique et un procédé de fabrication de l'appareil électronique. La structure de matériau d'interface thermique comprend, dans l'ordre : une couche de remplissage d'espace, une couche de tampon thermique et une couche adhésive présentant une première force d'adhérence au métal comprise entre 50 et 1 000 g/pouce, mesurée selon la méthode A de la norme ASTM D3330/D3330M, et une seconde force d'adhérence à la couche de tampon thermique supérieure d'au moins 10 % à la première force d'adhérence.