WO2026099153 - DEVICE CAPABLE OF BONDING AND DEBONDING ON DEMAND
National phase entry is expected:
Publication Number
WO/2026/099153
Publication Date
15.05.2026
International Application No.
PCT/EP2025/081751
International Filing Date
04.11.2025
Title **
[English]
DEVICE CAPABLE OF BONDING AND DEBONDING ON DEMAND
[French]
DISPOSITIF PERMETTANT UN COLLAGE ET UN DÉCOLLEMENT À LA DEMANDE
Applicants **
TESA SE
Inventors
KOLDEMIR, Unsal
HASAN, Nazmul
LOSSADA, Francisco
Priority Data
24210879.3
05.11.2024
EP
25198442.3
27.08.2025
EP
Application details
| Total Number of Claims/PCT | * |
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International Searching Authority |
EPO
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2640 | |
| EPO | Filing, Examination, Granting | 13412 | |
| Japan | Filing, Examination, Granting | 2400 | |
| South Korea | Filing, Examination, Granting | 2601 | |
| USA | Filing, Examination, Granting | 5940 |
Total:
26,993
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Abstract[English]
The present invention provides an adhesive device in which ion-conductive adhesives are positioned between two electrically conducive surfaces, either one backing and one substrate or both substrates. When a negative DC voltage is applied to the substrate, the adhesion strength of the tape decreases, allowing debonding from the substrate. In contrast, applying a positive DC voltage increases the adhesion strength, enabling bonding. This process can be repeated to achieve at least one cycle of bonding, debonding, and rebonding of the adhesive tape to the conductive substrate.[French]
La présente invention concerne un dispositif adhésif dans lequel des adhésifs conducteurs d'ions sont positionnés entre deux surfaces électriquement conductrices sous la forme soit d'un support et d'un substrat, soit de deux substrats. Lorsqu'une tension continue négative est appliquée au substrat, la force d'adhésion du ruban diminue, permettant le décollement du substrat. En revanche, l'application d'une tension continue positive augmente la force d'adhésion, permettant le collage. Ce processus peut être répété pour réaliser au moins un cycle de collage, décollement et recollage du ruban adhésif sur le substrat conducteur.