WO2025229065 - A HEATER TRACK APPARATUS AND A SEMICONDUCTOR PACKAGE ASSEMBLY LINE INCORPORATING SUCH HEATER TRACK APPARATUS
National phase entry is expected:
Publication Number
WO/2025/229065
Publication Date
06.11.2025
International Application No.
PCT/EP2025/061848
International Filing Date
30.04.2025
Title **
[English]
A HEATER TRACK APPARATUS AND A SEMICONDUCTOR PACKAGE ASSEMBLY LINE INCORPORATING SUCH HEATER TRACK APPARATUS
[French]
APPAREIL À PISTE CHAUFFANTE ET LIGNE D'ASSEMBLAGE DE BOÎTIER SEMI-CONDUCTEUR INCORPORANT LEDIT APPAREIL
Applicants **
NEXPERIA B.V.
Inventors
MIANO, Seth
UY, Marc Lester
GABUNADA, Reil
Priority Data
24173370.8
30.04.2024
EP
Application details
| Total Number of Claims/PCT | * |
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| Number of Drawings | * |
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International Searching Authority |
EPO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2024 | |
| EPO | Filing, Examination, Granting | 8126 | |
| Japan | Filing, Examination, Granting | 2155 | |
| South Korea | Filing, Examination, Granting | 2071 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
19,116
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Abstract[English]
A heater track apparatus and a semiconductor package assembly line comprising such heater track apparatus. The heater track apparatus is adapted to receive a reel-to-reel lead frame tape provided with an anti-tarnish layer. The heater track apparatus comprises a housing having a housing inlet and a housing outlet defining a process path line for the reel-to-reel lead frame tape, and a heating unit positioned within the housing next to the process path line structured to generate and emit heat towards the process path line.[French]
Sont divulgués un appareil à piste chauffante et une ligne d'assemblage de boîtier semi-conducteur comprenant ledit appareil. L'appareil à piste chauffante est conçu pour recevoir une bande de grille de connexion bobine à bobine pourvue d'une couche anti-ternissement. L'appareil à piste chauffante comprend un logement pourvu d'un orifice d'entrée et d'un orifice de sortie définissant une ligne de trajet de traitement pour la bande de grille de connexion bobine à bobine, ainsi qu'une unité de chauffage positionnée à l'intérieur du logement à côté de la ligne de trajet de traitement, structuré pour générer et émettre de la chaleur en direction de la ligne de trajet de traitement.