WO2025120221 - ELECTRONIC COMPONENT TRANSFER BY LEVITATION

National phase entry is expected:
Publication Number WO/2025/120221
Publication Date 12.06.2025
International Application No. PCT/EP2024/085221
International Filing Date 09.12.2024
Title **
[English] ELECTRONIC COMPONENT TRANSFER BY LEVITATION
[French] TRANSFERT DE COMPOSANT ÉLECTRONIQUE PAR LÉVITATION
Applicants **
NEXPERIA B.V.
Inventors
CONTE CAPODACQUA, Filippo Maria
TICHEM, Marcel
VAN DER VEEN, Gijs
Priority Data
23215155.5   08.12.2023   EP
Application details
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译文

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Quotation for National Phase entry

Country StagesTotal
China Filing, Examination, Granting2034
EPO Filing, Examination, Granting8107
Japan Filing, Examination, Granting2154
South Korea Filing, Examination, Granting2066
USA Filing, Examination, Granting4740
MasterCard Visa
Total: 19,101

The term for entry into the National Phase has expired. This quotation is for informational purposes only

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Abstract[English] Aspects of the present disclosure relate to a system for transferring an electronic component. Further aspects of the present disclosure relate to a method for transferring an electronic component. According to an aspect of the present disclosure, the system comprises a carrier having a first side, a droplet dispensing unit for dispensing a droplet of liquid on the first side of the carrier, and a separating unit for releasing an electronic component from a donor substrate and for allowing the electronic component to be held by the droplet of liquid on the first side of the carrier. The system further comprises an optical source for emitting a pulse of light through the carrier towards an interface between the droplet and the carrier to locally vaporize the droplet thereby causing a jet to be formed from the droplet that on one end holds the electronic component and that subsequently breaks to thereby release the electronic component onto a target substrate.[French] Des aspects de la présente divulgation concernent un système de transfert d'un composant électronique. D'autres aspects de la présente divulgation concernent un procédé de transfert d'un composant électronique. Selon un aspect de la présente divulgation, le système comprend un support ayant un premier côté, une unité de distribution de gouttelettes pour distribuer une gouttelette de liquide sur le premier côté du support, et une unité de séparation pour libérer un composant électronique d'un substrat donneur et pour permettre au composant électronique d'être maintenu par la gouttelette de liquide sur le premier côté du support. Le système comprend en outre une source optique pour émettre une impulsion de lumière à travers le support vers une interface entre la gouttelette et le support pour vaporiser localement la gouttelette, amenant ainsi un jet à être formé à partir de la gouttelette qui, sur une extrémité, maintient le composant électronique et qui se rompt ensuite pour libérer ainsi le composant électronique sur un substrat cible.