WO2025179439 - LIGHT EMITTING SUBSTRATE AND METHOD OF FABRICATING LIGHT EMITTNIG SUBSTRATE
National phase entry is expected:
Publication Number
WO/2025/179439
Publication Date
04.09.2025
International Application No.
PCT/CN2024/078659
International Filing Date
27.02.2024
Title **
[English]
LIGHT EMITTING SUBSTRATE AND METHOD OF FABRICATING LIGHT EMITTNIG SUBSTRATE
[French]
SUBSTRAT ÉLECTROLUMINESCENT ET PROCÉDÉ DE FABRICATION DE SUBSTRAT ÉLECTROLUMINESCENT
Applicants **
BOE TECHNOLOGY GROUP CO., LTD.
HEFEI BOE RUISHENG TECHNOLOGY CO., LTD.
Inventors
DONG, Wenbo
TIAN, Jian
HU, Jian
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
CNIPA
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| 译文 |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 1982 | |
| EPO | Filing, Examination, Granting | 14797 | |
| Japan | Filing, Examination, Granting | 2307 | |
| South Korea | Filing, Examination, Granting | 2376 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
26,202
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Abstract[English]
A light emitting substrate is provided. The light emitting substrate includes a base substrate; one or more pads on the base substrate; one or more insulating layers on a side of the one or more pads away from the base substrate, wherein, in a region having the one or more pads, the one or more insulating layers are absent, forming one or more vias through the one or more insulating layers; one or more solders on a side of the one or more pads away from the base substrate; and a light emitting element bonded to the one or more pads through at least the one or more solders at least partially in the one or more vias. A respective pad of the one or more pads includes a first main body and a respective first portion connected to the first main body.[French]
L'invention concerne un substrat électroluminescent. Le substrat électroluminescent comprend un substrat de base ; une ou plusieurs pastilles sur le substrat de base ; une ou plusieurs couches isolantes sur un côté de l'au moins une pastille à l'opposé du substrat de base, la ou les couches isolantes étant absentes dans une région comprenant l'au moins une pastille, formant ainsi un ou plusieurs trous d'interconnexion à travers la ou les couches isolantes ; une ou plusieurs soudures sur un côté de l'au moins une pastille à l'opposé du substrat de base ; et un élément électroluminescent lié à l'au moins une pastille à travers au moins la ou les soudures au moins en partie dans le ou les trous d'interconnexion. Une pastille respective parmi la ou les pastilles comprend un premier corps principal et une première partie respective reliée au premier corps principal.