WO2025043622 - SENSOR CHIP
National phase entry is expected:
Publication Number
WO/2025/043622
Publication Date
06.03.2025
International Application No.
PCT/CN2023/116194
International Filing Date
31.08.2023
Title **
[English]
SENSOR CHIP
[French]
PUCE DE CAPTEUR
Applicants **
BOE TECHNOLOGY GROUP CO., LTD.
BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Inventors
WANG, Lihui
LI, Yue
WEI, Qiuxu
GUO, Weilong
CHANG, Wenbo
ZHANG, Taonan
SUN, Jie
HE, Nana
QU, Feng
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
| * | |
| Number of Office Actions | * |
| * | |
International Searching Authority |
CNIPA
* |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
* |
| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| 译文 |
|
* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2241 | |
| EPO | Filing, Examination, Granting | 15843 | |
| Japan | Filing, Examination, Granting | 2307 | |
| South Korea | Filing, Examination, Granting | 2376 | |
| USA | Filing, Examination, Granting | 4740 |
Total:
27,507
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
A sensor chip is provided. The sensor chip includes a first base substrate; a piezoresistor on the first base substrate; a second base substrate on a side of the piezoresistor away from the first base substrate; a metal wire bond extending through the second base substrate; and a pressure reference chamber between the first base substrate and the second base substrate. The first base substrate and the second base substrate encapsulate at least a portion of the piezoresistor inside the pressure reference chamber.[French]
L'invention concerne une puce de capteur. La puce de capteur comprend un premier substrat de base ; une piézorésistance sur le premier substrat de base ; un second substrat de base sur un côté de la piézorésistance à l'opposé du premier substrat de base ; une liaison de fil métallique s'étendant à travers le second substrat de base ; et une chambre de référence de pression entre le premier substrat de base et le second substrat de base. Le premier substrat de base et le second substrat de base encapsulent au moins une partie de la piézorésistance à l'intérieur de la chambre de référence de pression.