WO2026024982 - HIGH-EFFICIENCY THERMOELECTRIC COOLING AND HEATING SYSTEMS
National phase entry is expected:
Publication Number
WO/2026/024982
Publication Date
29.01.2026
International Application No.
PCT/US2025/039138
International Filing Date
24.07.2025
Title **
[English]
HIGH-EFFICIENCY THERMOELECTRIC COOLING AND HEATING SYSTEMS
[French]
SYSTÈMES DE REFROIDISSEMENT ET DE CHAUFFAGE THERMOÉLECTRIQUES À HAUT RENDEMENT
Applicants **
ACTA-TECHUS, INC.
Inventors
KAUFMAN, Peter N.
DUNHAM, Gilbert H.
MASTERS, Andrew E
Priority Data
63/675,597
25.07.2024
US
19/250,390
26.06.2025
US
Application details
| Total Number of Claims/PCT | * |
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| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
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International Searching Authority |
USPTO
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| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
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| Type of Assignment |
The Standard Agent's Assignment
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| Applicant's Legal Status |
Legal Entity
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| * | |
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| Entry into National Phase under |
Chapter I
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| Patent Delivery |
Send the Letters Patent by Courier
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| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 3607 | |
| EPO | Filing, Examination, Granting | 25234 | |
| Japan | Filing, Examination, Granting | 2803 | |
| South Korea | Filing, Examination, Granting | 3435 | |
| USA | Filing, Examination, Granting | 10160 |
Total:
45,239
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Abstract[English]
A device which comprises a thermoelectric module, where the thermoelectric module comprises a support structure, a first array of interconnect pads, a second array of interconnect pads, and a plurality of thermoelectric semiconductor pellets. The support structure has a first outer side and a second outer side, opposite the first outer side. The first array of interconnect pads is disposed on the first outer side of the support structure. The second array of interconnect pads is disposed on the second outer side of the support structure. The plurality of thermoelectric semiconductor pellets is disposed within the support structure, wherein each thermoelectric semiconductor pellet is connected to at least one interconnect pad of the first array of interconnect pads or the second array of interconnect pads.[French]
L'invention concerne un dispositif qui comprend un module thermoélectrique, le module thermoélectrique comprenant une structure de support, un premier réseau de plots d'interconnexion, un second réseau de plots d'interconnexion et une pluralité de pastilles semi-conductrices thermoélectriques. La structure de support a un premier côté externe et un second côté externe, opposé au premier côté externe. Le premier réseau de plots d'interconnexion est disposé sur le premier côté externe de la structure de support. Le second réseau de plots d'interconnexion est disposé sur le second côté externe de la structure de support. La pluralité de pastilles semi-conductrices thermoélectriques est disposée à l'intérieur de la structure de support, chaque pastille semi-conductrice thermoélectrique étant connectée à au moins un plot d'interconnexion du premier réseau de plots d'interconnexion ou du second réseau de plots d'interconnexion.