WO2023177749 - LID ALLOWING FOR A THERMAL INTERFACE MATERIAL WITH FLUIDITY IN A LIDDED FLIP CHIP PACKAGE
National phase entry is expected:
Publication Number
WO/2023/177749
Publication Date
21.09.2023
International Application No.
PCT/US2023/015312
International Filing Date
15.03.2023
Title **
[English]
LID ALLOWING FOR A THERMAL INTERFACE MATERIAL WITH FLUIDITY IN A LIDDED FLIP CHIP PACKAGE
[French]
COUVERCLE POUR MATÉRIAU D'INTERFACE THERMIQUE À FLUIDITÉ DANS UN BOÎTIER DE PUCE RETOURNÉE À COUVERCLE
Applicants **
IC CHIP COOLING TECHNOLOGIES LLC
Inventors
SHEN, Yuci
Priority Data
17/695,826
15.03.2022
US
Application details
| Total Number of Claims/PCT | * |
| Number of Independent Claims | * |
| Number of Priorities | * |
| Number of Multi-Dependent Claims | * |
| Number of Drawings | * |
| Pages for Publication | * |
| Number of Pages with Drawings | * |
| Pages of Specification | * |
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| Number of Office Actions | * |
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International Searching Authority |
USPTO
* |
| * | |
| Recordal of a Change of the Applicant's Name/Address |
Change of Applicant's Name and Address
* |
| Type of Assignment |
The Standard Agent's Assignment
* |
| Applicant's Legal Status |
Legal Entity
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| * | |
| * | |
| * | |
| * | |
| * | |
| Entry into National Phase under |
Chapter I
* |
| Patent Delivery |
Send the Letters Patent by Courier
* |
| Translation |
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* The data is based on automatic recognition. Please verify and amend if necessary.
** IP-Coster compiles data from publicly available sources. If this data includes your personal information, you can contact us to request its removal.
Quotation for National Phase entry
| Country | Stages | Total | |
|---|---|---|---|
| China | Filing, Examination, Granting | 2390 | |
| EPO | Filing, Examination, Granting | 15011 | |
| Japan | Filing, Examination, Granting | 2347 | |
| South Korea | Filing, Examination, Granting | 2514 | |
| USA | Filing, Examination, Granting | 4510 |
Total:
26,772
The term for entry into the National Phase has expired. This quotation is for informational purposes only
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Abstract[English]
The disclosure describes a lid allowing for a thermal interface material with fluidity, like a liquid metal, in a lidded flip chip package, including: a lid, a sealing ring for forming a sealed gap between a flip chip and the lid, a storage tunnel in the lid for accepting or releasing a liquid from or to the sealed gap, a connecting hole connecting the sealed gap with the storage tunnel, an injection hole with a plug, wherein a plug structure is formed at an outer end of the storage tunnel for opening or closing it, a slippery skin is arranged on an inner surface of the storage tunnel for a better flow of a liquid metal in it, the sealed gap is completely filled with a liquid metal, and a portion of the storage tunnel is filled with the same liquid metal and its remaining portion is filled with a gas.[French]
La divulgation décrit un couvercle pour un matériau d'interface thermique à fluidité, tel qu'un métal liquide, dans un boîtier de puce retournée à couvercle, comprenant : un couvercle, une bague d'étanchéité pour former un espace étanche entre une puce retournée et le couvercle, un tunnel de stockage dans le couvercle pour accepter ou libérer un liquide depuis ou vers l'espace étanche, un trou de connexion connectant l'espace étanche au tunnel de stockage, un trou d'injection doté d'un bouchon, une structure de bouchon étant formée au niveau d'une extrémité externe du tunnel de stockage pour l'ouverture ou la fermeture de celui-ci, un revêtement glissant étant placé sur une surface interne du tunnel de stockage pour un meilleur écoulement d'un métal liquide dans celle-ci, l'espace étanche étant complètement rempli d'un métal liquide, et une partie du tunnel de stockage étant remplie avec le même métal liquide et sa partie restante étant remplie d'un gaz.